Microwave Journal
www.microwavejournal.com/articles/19292-electronic-design-innovation-conference-2013-a-solid-technical-program-from-start-to-finish

Electronic Design Innovation Conference 2013: A Solid Technical Program from Start to Finish

February 27, 2013

For its first year, the EDI CON organizers relied on their experience as editors of Microwave Journal and Microwave Journal China to put together a technical program that had something for mostly everyone involved in high-frequency electronic design and system integration. The latest systems of interest from space (GNSS) to 4G (TD-LTE) to very close (Near-Field Communications) are being represented in the technical tracks and workshops. Design activity from device modeling and characterization, simulation and verification is also being presented in a number of ways. For the RF engineers, standard radio block component designs such as filters, amplifiers, detectors, couplers and PLLs/VCOs will be presented. New and promising technologies such as digital pre-distortion, envelope tracking, software defined radio, MIMO and GaN semiconductors will be presented. Peer reviewed papers will appear side-by-side with a commercial track that emphasizes commercially available technologies.

A strong emphasis on MMIC and RFIC design will be carried throughout the workshops with two sessions on RF CMOS technologies, two separate Doherty PA design workshops, frequency converters (mixers, doublers) characterization workshop,  X-Band MMIC design and “marquee” GaN Panel forum featuring Freescale, M/A-COM Technology Solutions, Microsemi, Nitronex and TriQuint all taking place on Wednesday afternoon.

High-speed digital designer will also be treated to a workshop on high-speed measurement techniques, another on high-speed interconnect challenges and modeling Drude and Lorentz materials using time domain EM simulation. EM, Antenna system design, simulation of antenna GSM tracking and MIMO beamforming workshops represent four individual back-to-back workshop sessions for the antenna design engineer.

The second day technical program features state-of-the-art passive and active circuit design with an inverse class-f amplifier, behavioral modeling for advanced design, PLL frequency synthesizer with DDS feedback loop, and more. Several system papers examine the use of FPGAs in receiver designs, IFM, digital pre-distortion networks, a MIMO MMSE detector and  high-speed designs and the measurement modeling and commercial tracks explore time and mixed domain analyses and spectrum monitoring and re-use for commercial and defense-related applications.

The program finale ends with four simultaneous panels featuring panels of experts interacting directly with the audience on design issues impacting high-frequency connectivity. The longer format allows a more detailed discussion of topics that impact communications and the components used in communication systems including a panel on cable/connector considerations for specific applications, RF front-ends for mobile communications, EDA design flows for PCB, RFIC and MMIC applications and MIMO Over-the-air testing for mobile devices and networks.

For more detail on the technical conference visit: http://www.ediconchina.com/conf_program.pdf