Microwave Journal

EDI CON 2013 Organizers Announce Dr. Song Junde as Honorary Chair of Inaugural Event in Beijing

Appointment connects learning opportunities in high-frequency electronic design with needs of industry, academia and government research organizations

December 19, 2012

Norwood, Massachusetts, December 20, 2012 – EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design organized by Microwave Journal and Horizon House has announced the selection of Dr. Song Junde, Professor at the Beijing University of Posts and Telecommunications, as the Honorary Chair of this inaugural technical conference and trade exposition. In recognition of his many contributions to advancing microwave technology and the communications industry in China, the event organizers and technical program planning committee have asked Dr. Song to represent EDI CON 2013 and its conference to the engineering and academic communities that will benefit from its content. In his role as Honorary Chair,  Dr. Song will be consulting on the final details of the technical program and will be delivering the Welcoming Message at the keynote plenary session on March 12th.

Dr. Song has held numerous prestigious positions in government ministries, academia and communication standard bodies. His extensive technical background has been called upon by these organizations to help recruit, support and access the qualifications of postgraduate candidates specialized in electrical circuit and system, microelectronics and solid state electronics with an emphasis on mobile communication theoretical design and ASIC methods; Multi- communications system fusion, next generation network and terminal; broadband wireless mobile internet; mobile communication theory and application.

As one of China's leading telecom experts, Professor Song has won numerous awards including first prize (Ministry of Science and Technology Progress Award) from the State Education Commission for national scientific and technological progress in electronics and has been recognized by the National Natural Science Foundation for his science and technology research and international cooperation. Song has published over a dozen books and teaching material along with nearly 200 technical papers in English and Chinese on mobile communications and the Internet, the future of communications, CTI / CRM, VLSI CAD field. His current research focus is on the next generation of wireless mobile Internet theory and technology (3G, B3G, 4G, WIFI, WiMAX) and other aspects of research. His research interests also include next-generation telecommunications network and its supporting systems and related services, heterogeneous networks. Dr. Song has visited the United States and more than 30 countries in support of his scientific research and teaching.

Professor Song Junde, PhD supervisor. Electronic Engineering, Beijing University of Posts and Telecommunications is currently the Academic Council Director, Chairman of China Communications Standards Association, CMIS, honorary Doctor of the Moscow Institute of Electronic Engineering, the State Council Academic Degree Committee disciplinary assessment team members, the State Ministry of Personnel postdoctoral accreditation experts, the international information Federation of IFIP TC7 Chinese President, Information Ministry of Communications Science and Technology Industry Committee members and the satellite and radio consultants, China Communications Standards Association Expert Advisory Committee of experts, China Computer Federation and the data communication network, deputy director of the Committee. Ministry of Information Industry and ministerial key laboratories PCN & CAD Center and CTI Research Centre, Beijing served as the Chairman of the Committee of Posts and Telecommunications large school degree, graduate school dean and other staff.

About EDI CON 2013

EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.

For information on the conference program, ongoing updates and major announcements and to register for EDI CON 2013 visit:


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