Microwave Journal

Tech-X Corp. releases Vorpal 6.0

December 4, 2012

Tech-X Corp. of Boulder, CO announced the release of Vorpal 6.0. New in the release is the customization of Vorpal for targeted industries. With the VSimEM package for electrostatic and electromagnetic problems, VSimMD for the microwave device optimization, VSimPA for plasma acceleration simulations, VSimPD for plasma discharge simulations, VSimBase for the educational market, and VSimPro, which provides the full features of Vorpal, the pricing and use of Vorpal is more flexible and more focused on meeting the needs of customers.

Expertise to Solve Complex Problems

New examples targeting each problem domain enable users to reach their first solution faster than ever. In addition, improved analysis tools facilitate more detailed understanding of simulations. Many physics improvements are in this release, including far field calculations, circuit models, new port model with feedback, field ionization of arbitrary species, and more flexible collisions.