Microwave Journal

Back to School

September 10, 2012

With the arrival of September, we welcome the start of the new school year, the NFL season and New England foliage. My kids are already complaining about their school workload, but my Patriots are off to a stellar start with a convincing win at Tennessee. September also marks the start of the fall conference season, with a number of events on the horizon.

I’ll be attending the AUTOTESTCON show this week with Brian Landy, our new Western Regional Sales Manager. MWJ will also have a presence at the IEEE ICUWB conference in Syracuse, NY and the PT/Expo Comm in Beijing, China. Next month heats up with the COMSOL Conference (Boston, MA), AMTA (Bellevue, WA), MILCOM (Orlando, FL) and European Microwave Week (Amsterdam).   

EuMW is shaping up nicely, with a nearly full exhibition hall and an impressive conference lineup. The third annual “Defence, Security and Space Forum” will take place on Wednesday, October 31st during the event and features a panel session from sponsors Rohde & Schwarz, RFMD, TriQuint Semiconductor, National Instruments and Peregrine Semiconductor. There are still a few stands available in the exhibition, so contact Kristen Anderson or your sales rep if interested.  We will also be producing our annual “Online Show Dailies”, and a few dates remain available for exclusive sponsorship.  

The October issue of MWJ will have bonus distribution at MILCOM, which fits nicely with the issue’s “Military and Government Electronics” theme. The deadline to book ad space in this issue is September 14th, with ad material due by September 19th. For more information on the October issue, check the “Ad Bulletin” or contact your sales representative.

The November/December issue of Microwave Journal China will be distributed at the International Microwave Exhibition (IME) in Shanghai in early November. MWJ China is a media sponsor of this show and an exhibitor. The MWJ China website (mwjournalchina.com) and monthly newsletter are gaining traction and readers, offering companies additional opportunites to reach this growing market.

Looking further down the road in China, the Electronic Design Innovation Conference (EDI CON) is coming together very nicely with lots of technical papers submitted for review and some timely workshops and panel sessions taking shape. The latest companies to sign up for the exhibition include Rogers Corp., Spirent, Tektronix, Analog Devices, LPKF, Maury Microwave, Focus Microwaves, Sanetronic, CETC 41 and OMMIC, joining an already impressive list of industry leaders. Visit www.EDICONCHINA.com for the latest information.

Regards,

Carl Sheffres

Publisher