Microwave Journal

Agilent Announces Shipment of 3D EM Simulation Platform

December 15, 2011

Agilent Technologies Inc. announced shipment of the latest release of its Electromagnetic Professional software, EMPro 2011.11. The updated 3D modeling and simulation platform features enhancements to further speed and improve RF design and verification.

Tightly integrated with Agilent’s Advanced Design System, EMPro is used to create 3D models and analyze electrical performance of packages, connectors, antennas and other RF components. The EMPro 2011.11 release builds on advances made available in the 2011.07 release, introducing key improvements to the finite-element method simulator:

• A fast FEM iterative solver that doubles the speed of simulations that include internal ports (which had already been doubled in the previous release). This continuous improvement reflects Agilent’s ongoing commitment to fast-paced advancements in simulation technology.

• A user-defined passive loads capability. This allows users to include ideal passive loads directly in an FEM simulation to represent matching circuits and surface-mount components. (The loads are defined in the EM setup environment, which consists of common series and parallel RLC network topologies. This capability enables accurate field visualization results and radiation patterns that take into account passive loads.)

• A fast, two-dimensional port solver that simplifies FEM simulation port setup. The solver allows users to quickly and easily determine the number of modes, as well as reference impedance and optimum impedance line placement.