SemiGen Relocates, Expanding Assembly and Test Capabilities
SemiGen Inc., an expert in RF/microwave hybrid assembly and testing, semiconductor evaluation and packaging, and automated PCB manufacturing, has announced that the company is moving to a new facility and expanding its RF/microwave assembly and test capabilities. To meet the demands of customer requirements and to accommodate SemiGen’s recent acquisitions and new product line repair business, SemiGen has relocated from its former location in Londonderry, NH to 920 Candia Road in Manchester, NH. The new, 25,000-square-foot space adds a second SMT line as well as a Class 10000 ESD Zero clean room for RF microwave assembly, and SemiGen’s newest capital acquisition, an MRSI605 Automatic Eutectic Die Bonder.
SemiGen’s certified assemblers are experts in advanced thermo compression, ultrasonic, ball-bonding, and hand-assembly techniques. Standard services include: die attachment (epoxy or solder), wire and ribbon bonding (gold and aluminum), coil winding and tacking, beam lead diode attachment, feedthru installation, board installation (epoxy, solder, screw down), hand soldering, surface mounting, and epoxy encapsulation. In addition to build-to-print services, SemiGen offers troubleshooting, repair, and re-certification of units that return from the field. SemiGen’s facility is approved by several defense contractors and can up screen devices to comply with all military specifications and requirements.
SemiGen also provides electrical and quality testing of RF/microwave hybrids and components up through 40 GHz in an in-house test lab. They offer full tuning to customer requirements, inspection, and final ATP with Certificate of Compliance. Typical tuning methods include stub-tuning, impedance matching, capacitive, and inductive. SemiGen tests on a number of parameters, including isolation, insertion loss, gain, noise figure, VSWR, phase and phase tracking, IP3, switching speed, various power testing, lifetime, series resistance, DC electricals (VF, VB, CT, IR), bond-pull testing and die shear, and failure analysis of diodes.