Microwave Journal

DesignCon 2011: Making Chip Design Easier

January 27, 2011

UBM Electronics, a UBM company and the daily source of essential business and technical information for the electronics industry's decision makers, announced that this year's four-day conference will host 268 speakers delivering 14 tracks and more than 125 sessions focused on the toughest design challenges faced by engineers, including chip-level system design, high-speed signal processing, power, RF, T&M, PCB, analog and mixed signal, FPGAs and system co-design. The conference and papers deliver highly technical content created by engineers for engineers. The DesignCon 130-member technical committee creates the sessions and works with the paper authors over a 12-month period in order to ensure that the best work in the field of chip design is covered during the conference. The DesignCon Conference is held from January 31 – February 4 at the Santa Clara Convention Center, Santa Clara, CA.

While touted as "THE" technical conference of the year, those attending DesignCon will also have time for relaxation and fun. Conference sponsor, NXP, will host free photos with ChipHead at the ChipHead photo booth. Attendees are encouraged to stop by the Apache Design Solutions, Design Tour, Huber + Suhner or Spanaway booths for giveaways.

"We look forward to seeing and talking with the attendees as they come to learn about the newest products and trends from the top engineering technology companies in the world," said David Blaza, UBM Electronics Vice President. "DesignCon is 100 percent industry expert pure content. We are honored to be the voice of the engineer through an amazing display of technologies, papers and sessions helping engineers with real-world solutions to the complex challenges of chip design."