Microwave Journal

DesignCon Announces 2011 Tracks and Sessions

January 3, 2011

UBM Electronics, a UBM company and the daily source of essential business and technical information for the electronics industry's decision makers, announced the selection of the DesignCon 2011 conference track sessions and educational forums. As the first engineering conference of the year, designers have an opportunity to jumpstart projects by participating in sessions and forums that bring together chip, board and system design challenges.

Known as the premiere technical conference, DesignCon, located in the Santa Clara Convention Center from January 31st through February 3rd, will host more than 100 sessions discussing chip-level system design, high-speed signal processing, power, RF, T&M, PCB, analog and mixed signal, FPGAs and system co-design. During the educational forums, engineers will be introduced to new, practical information about USB 3.0 serial link design, optimization and validation, and a simple and powerful method to characterize differential interconnects based on a new calibration technique based on the 2x thru fixture removal process. Additionally, Agilent Technologies, the event's Host Sponsor, will hold two half-day educational forums on January 31st and February 1st. The first session will focus on USB 3.0 serial link development. The second will address a new method to characterize differential interconnects.

Additional information about the sessions, panels and keynotes is available on the new DesignCon website: http://designcon.techinsightsevents.com/.

"Since the highly successful 2010 conference, we have spent several months examining the toughest chip, board and system design challenges that will face engineers in 2011 and beyond. The sessions, forums and keynote will discuss those challenges and provide the attendees with real-world, proven research, advice and tips that will, hopefully, make their jobs easier," said Ron Wilson, UBM Electronics Director of Content and Media for events.