Microwave Journal

2010 Editorial Index

December 8, 2010

ANTENNAS

An, Jian, Guang-ming Wang, Chen-xin Zhang and Hui-yong Zeng
“A Compact, Omni-directional, Circularly Polarized Microstrip Antenna,” No. 1, p. 82.


Chen, Wen-Shan and Yen-Hao Yu
“Planar Rhombic Arm Dipole Antenna with Parasitic Elements for Wireless Applications,” No. 9, p. 150.

Gampala, Gopinath, Rohit Sammeta and C.J. Reddy
“A Thin, Low-profile Antenna Using a Novel High Impedance Ground Plane,” No. 7, p. 70.

Guha, Debatosh, Yahia M.M. Antar, P. Beland and M. Roper
“A Small Size, High Gain Antenna for Wireless Base Station Applications,” No. 1, p. 92.

Jung, Jinwoo, Yeongseog Lim and Hyeonjin Lee
“A Compact Planar Monopole Antenna for Ultra-wideband Operation,” No. 1, p. 100.

Liu, Wen-Chung and Jiun-Kai Chen
“A Dual-band CPW-fed Monopole Antenna for IMT-2000/WLAN,” No. 5, p. 124.

Nesic, A., I. Radnovic, Z. Micic and S. Jovanovic
“Side Lobe Suppression of Printed Antenna Arrays for Integration with Microwave Circuits,” No. 10, p. 72.

Palreddy, Sandeep and Rudolf Cheung
“Two-arm Archimedean Spiral Helical Antenna with Wraparound Absorber,” No. 4, p. 194.

Razavi-Rad, Majid, Changiz Ghobadi, Javad Nourinia and Reza Zaker
“A Small Printed Ultra-wideband Polygon-like Wide-slot Antenna with a Fork-like Stub,” No. 3, p. 118.

Sanad, Mohamed and Noha Hassan
“A 470 to 960 MHz Resonant Antenna: Covering UHF Mobile TV and CDMA/GSM without Tuning Circuits,” No. 11, p. 56.

Zhao, Xiongwen
“Internal PIFA Performance Evaluations for a Satellite-terrestrial Handset,” No. 8, p. 84.

COMMERCIAL APPLICATIONS

Werner, K. and S. Theeuwen
“RF Driven Plasma Lighting: The Next Revolution in Light Sources,” No. 12, p. 68.

COMPONENTS/SUBSYSTEMS

Boles, Timothy and Andrew Freeston
“New NanoSecond Switch Technology,” No. 6, p. 56.

Flores, Jose Luis
“The Distances Chart: A New Approach to Spurs Calculation,” No. 2, p. 86.

Simpson, Gary and David Ballo
“Ultra-fast, Simpler and More Accurate Noise Parameter Measurements,” No. 3, p. 82.

Singh, K., K. Ngachenchaiah, D. Bhatnagar and S. Pal
“Notch Implemented Dual Behavior Resonator Filter and Diplexer at Ku-band,” No. 4, p. 206.

COVER FEATURES

Foegelle, Michael D.
“Creating a Complex Multipath Environment Simulation in an Anechoic Chamber,” No. 8, p. 56.

Frame, James, Jeritt Kent and Ian Lawee
“The Smart Grid Communications Evolution: “Closing the Loop” for the Intelligent Electrical Grid,” No. 12, p. 24.

Gurumurthy, Madhu
“Dynamic Correlation in Virtual Drive Testing,” No. 8, p. 76.

Hindle, Patrick
“2010 GaAs Foundry Services Outlook,” No. 6, p. 20.

Hindle, Patrick
“The State of RF/Microwave Switches,” No. 11, p. 20.

Marshall, Chris and Bill Murphy
“Field Support Streamlines Design and Development Cycles,” No. 2, p. 24.

Rohde, Ulrich L. and Ajay K. Poddar
“Emerging Technology and Market Trends for Frequency Controlled Circuits and Timing Devices,” No. 5, p. 20.

Rumney, Moray
“The MIMO Antenna: Unseen, Unloved, Untested!,” No. 8, p. 22.

Sieber, Michael and Attila Simon
“On the Right Wavelength: Microwave and RF Technology for Defence,” No. 10, p. 22.

Skousen, Derek and Charlie Orlenius
“Embracing Complexity: MIMO Over-the-air Testing with the Reverberation Chamber,” No. 8, p. 66.

Swift, Chuck and Les Besser
“Microwaves in the Land of Sun and Honey,” No. 4, p. 28.

Vye, David
“Fundamentally Changing Nonlinear Microwave Design,” No. 3, p. 22.

Vye, David
“How Design Software Changed the World, Part II,” No. 7, p. 20.

Vye, David
“The Economics of Handset RF Front-end Integration,” No. 9, p. 22.

Wensinger, Jeremy
“Supporting the Warfighter: Adapting to the Changing Paradigm of the Defense Market,” No. 1, p. 24.

DESIGN

Aleiner, Boris
“Power Amplifier Module for Polar Modulation,” No. 2, p. 110.

Amrani, F., M. Trabelsi, R. Aksas and A. Azrar
“Bandwidth Improvement of a Single-stage Distributed Amplifier,” No. 5, p. 112.

Angeletti, Piero and Marco Lisi
“Multiport Power Amplifiers for Flexible Satellite Antennas and Payloads,” No. 5, p. 96.

Chapell, Harry
“An Overlooked Class of N-way Power Dividers Combining Resistive and Reactive Dividers,” No. 6, p. 88.

Chen, Xiao Qun, Ling Xia Wang, Chang Yun Cui and Xiao Wei Shi
“Design of a Microstrip Open Loop Resonator BPF with Wide Stopband for WLAN,” No. 6, p. 76.

Cheng, Chia-Shih, Hsien-Chin Chiu, Shao-Wei Lin and Jeffrey S. Fu
“Improved Linearity Performance of a PHEMT Driver Amplifier Using Tunable Field-plate Voltage,” No. 9, p. 130.

Cheng, J., S. Li, B. Han and J. Gao
“Analysis and Modeling of the Pads for RF CMOS Based on EM Simulation,” No. 10, p. 96.

Duong, Thai Hoa and Ihn S. Kim
“A UWB BPF Based on a Capacitively Coupled Cross Resonator,” No. 9, p. 140.

Garcia-Vazquez, Sunil L. Khemchandani, J. Arias-Perez and J. del Pino
“Flatness Improvement for a Shunt-peaked Ultra-wideband Low Noise Amplifier,” No. 11, p. 74.

Hagensen, M.
“Narrowband Microwave Bandpass Filter Design by Coupling Matrix Synthesis,” No. 4, p. 218.

Kaddour, D., J.D. Arnould and P. Ferrari
“Miniaturized Semi-lumped UWB Bandpass Filter with Improved Out-of-band Performances,” No. 10, p. 110.

Liu, Haiwen and Fu Tong
“Performance Improvement of Power Amplifiers Using an Asymmetrical Spurline Structure,” No. 1, p. 76.

Logan, N., J.M. Noras and J.G. Gardiner
“A Highly Linear Low Noise Amplifier,” No. 5, p. 86.

Mandeep, J.S., H. Abdullah and Nitesh Ram
“A Compact, Balanced Low Noise Amplifier for WiMAX Base Station Applications,” No. 11, p. 84.

Marchetti, M.
“Mixed-signal Active Load Pull: The Fast Track to 3G and 4G Amplifiers,” No. 9, p. 108.

Rautio, James, John Reynolds and Allen F. Horn III
“Direction Matters: Including Substrate Anisotropy in Planar Circuit Design Flow,” No. 2, p. 98.

Yao, Xi, S.C. Jung, M.S. Kim, J.H. Van, H. Cho, S.W. Kwon, J.H. Jeong, K.H. Lim, C.S. Park, Y. Yang and H.C. Park
“Analysis and Design of the Doherty Amplifier Based on Class F and Inverse Class F Amplifiers,” No. 3, p. 100.

Yun, Young
A Miniaturized Multi-section Transformer on RFIC for Low Impedance Transformation in UWB,” No. 12, p. 76.

DEVICES

Azam, S., C. Svensson and Q. Wahab
“Comparison of Two GaN Transistor Technologies in Broadband Power Amplifiers,” No. 4, p. 184.

Bailly, Mark
“Diamond Rf™ Resistives: The Answer to High Power and Low Capacitance,” No. 11, p. 94.

Grebennikov, Andrei
“A 1.7 to 2.7 GHz Transmission-line GaN HEMT Power Amplifier for Wireless Applications,” No. 10, p. 128.

Rohde, Ulrich L. and Ajay K. Poddar
“Active Mode-couplings Enable High Frequency Fundamental VCXOs,” No. 9, p. 120.

Wei, Chien-Cheng, Chin-Ta Fan, Ta-Hsiang Chiang, Ming-Kuen Chiu and Shao-Pin Ru
“Direct Plated Copper Metallized Substrate and Its Application on Microwave Circuits,” No. 10, p. 84.

EUROPEAN MICROWAVECONFERENCE

Dambrine, Gilles and Ivar Bazzy
“Welcome to European Microwave Week 2010,” No. 9, p. 68.

Mumford, Richard
“Attending European Microwave Week 2010,” No. 9, p. 72.

INSTRUMENTS/MEASUREMENTS

Wall, Craig
“AFM-VNA Technique Enables Compound, Calibrated Electrical and Spatial Measurements at Nanoscale,” No. 12, p. 58.

MIC/MMIC

Wei, Chien-Cheng, Chin-Ta Fan, Ta-Hisang Chiang, Ming-Kuen Chiu and Shao-Pin Ru
“A Comparison of a Microstrip Open Loop Resonator BPF with Wide Stopband for WLAN,” No. 6, p. 76.

MTT-S CONFERENCE

Deval, Yann
“2010 RFIC Symposium: RF Design for New Horizons,” No. 4, p. 70.

Hess, Sherry
“IMS 2010 MicroApps: Diversity in Microwaves,” No. 4, p. 76.

Hindle, Patrick, Richard Mumford and David Vye
“Assignment: Anaheim,” No. 4, p. 94.

Hindle, Patrick
“Making Waves in California: 2010 MTT-S IMS Wrap Up,” No. 7, p. 68.

McKinney, J.K.
“Welcome to the 2010 IEEE MTT-S International Microwave Symposium,” No. 4, p. 66.

Vye, David
“California Dreamin’,” No. 4, p. 26.

Wong, Ken
“75th ARFTG Conference Highlights,” No. 4, p. 74.

PRODUCT FEATURES

Agilent Technologies Inc.
“A Comprehensive Baseband Generator and Channel Emulator,” No. 3, p. 128.

Agilent Technologies Inc.
“32 GHz True Analog Bandwidth Oscilloscope,” No. 6, p. 96.

Analog Devices Inc.
“A 2.4 GHz Low Power, Short-range Transceiver,” No. 6, p. 30.

Analog Devices Inc.
“IF and RF DVGAs for Next Generation Wireless Systems,” No. 11, p. 30.

AnaPico AG
“Fully Automated Signal Analyzer,” No. 12, p. 102.

Anaren Inc.
“Xinger®-III Family of 3 dB Hybrid and Directional Couplers,” No. 9, p. 170.

Anritsu Co.
“New Demodulation Analyzers Bring Benchtop Performance to Handheld Spectrum Analyzers,” No. 3, p. 134.

Anritsu Co.
“First 43 GHz Handheld Spectrum Analyzer Family,” No. 8, p. 18.

Ansoft Corp.
“Ansoft Designer/Nexxim Version 5.0,” No. 2, p. 38.

ANSYS Inc.
“HFSS and HSPICE Solver on Demand in Ansoft Designer 6.0,” No. 7, p. 118.

Avago Technologies
“Ultra Low NF Active Bias LNA Address BTS RF Front-end Design Challenges,” No. 4, p. 238.

AWR Corp
“Planar Antenna Simulation in AXIEM,” No. 7, p. 42.

Azimuth Systems
“Bridging the Gap Between MIMO Lab and Field Test Results,” No. 8, p. 102.

CST of America
“CST STUDIO SUITE 2011: Integrating Simulation Technology,” No. 12, p. 92.

Dielectric Laboratories Inc.
“GPS Filters,” No. 8, p. 82.

EB (Elektrobit)
“A MIMO Over-the-Air Emulator for Testing Wireless Terminals,” No. 3, p. 46.

Emblation Microwave
“A Compact, High Power 2.45 GHz Microwave Generator,” No. 5, p. 146.

Freescale Semiconductor
“A 50 V LDMOS Power Transistor for High Impedance Mismatch Applications,” No. 12, p. 108.

Fujitsu Semiconductor America Inc.
“Fujitsu Ships First 3G and LTE SAW-less Tranceiver,” No. 9, p. 172.

Hittite Microwave Corp.
“MicroSynth™ Integrated Hermetic Synthesizer Module,” No. 4, p. 234.

Hittite Microwave Corp.
“Hittite Launches Two Low Cost, Highly Flexible RMS Power Detectors,” No. 6, p. 114.

Hittite Microwave Corp.
“Monolithic Solution for Class A Amplifier Biasing: Hittite Active Bias Controller,” No. 9, p. 158.

Hittite Microwave Corp.
“Compact, Low SSB Phase Noise Wideband VCOs Cover 6 to 20 GHz,” No. 11, p. 122.

HUBER + SUHNER AG
“RF Connector Series Offers Greater Axial and Radial Float,” No. 7, p. 114.

Integra Technologies Inc.
“Novel GaN Technology Enhances S-band Radar Performance,” No. 6, p. 100.

Integra Technologies Inc.
“1000 W Amplifier for S-band Linear Accelerator Applications,” No. 10, p. 152.

Javelin Semiconductor
“3G Power Amplifier Promises to Initiate Industry Shift to CMOS,” No. 5, p. 46.

KMW USA Inc.
“Triple Mode Filter for Wireless Communication Systems,” No. 11, p. 112.

Linear Technology Corp.
“Ideal Solution for EMI,” No. 7, p. 108.

MECA Electronics
“Power Divider/Combiners Offer Low-loss and High Isolation,” No. 11, p. 124.

Mimix Broadband
“New Ultra Broadband QFN Packaged Amplifier,” No. 5, p. 136.

Mini-Circuits
“Ultra Long Life Mechanical RF Switches,” No. 2, p. 120.

MITEQ Inc.
“SSPA Drives Ka-band Links from 26 to 31 GHz,” No. 10, p. 40.

Mitsubishi Electric Corp.
“Switchable W-CDMA Power Amplifier Modules Supporting LTE,” No. 1, p. 108.

Nearfield Systems Inc.
“Arch Roll Spherical Nearfield Scanner,” No. 1, p. 116.

NXP Semiconductors
“ISM RF Power LDMOS Transistor Family,” No. 12, p. 110.

OMMIC
“37 to 43 GHz Power Amplifier Family,” No. 4, p. 246.

Park Electrochemical Corp.
“High Frequency, Low Loss Resin System,” No. 2, p. 126.

Peregrine Semiconductor Corp.
“UltraCMOS™ Fully Symmetric SP6T RF Switch for 3G Design,” No. 9, p. 164.

Quartzlock (UK) Ltd.
“A GPS Disciplined OCXO Frequency Standard & NTP Reference Clock,” No. 6, p. 106.

Radiall USA Inc.
“Validating a 3 GHz Calibration Kit for Testing to 6 GHz,” No. 11, p. 102.

RFConnext Inc.
“Giga-Low Handy Probe™ Enabled by Advanced Transmission Line Technologies,” No. 9, p. 166.

RFMD
“The First in a Family of Versatile High Power GaN Transistors,” No. 1, p. 40.

Rogers Corp.
“Integral Planar Resistors Save Circuit Board Space,” No. 10, p. 142.

Rohde & Schwarz
“Real-time Spectrum Analyzer Provides Seamless Signal Capture,” No. 7, p. 102.

Rohde & Schwarz
“High-performance Oscilloscopes with Bandwidths Up to 2 GHz,” No. 8, p. 94.

Rogers Corp.
“New High Frequency PCB Materials for the Power Amplifier Industry,” No. 5, p. 140.

Rogers Corp.
“Rogers’ New RO4360™ Laminates and RO4460™ Prepreg for Multilayer Power Amplifier Designs,” No. 8, p. 108.

RT Logic
“Telemetrix 400 Real Time Channel Simulator,” No. 8, p. 98.

Schmid & Partner Engineering AG (SPEAG)
“Software Platform for MRI Phased Array System Design and Optimization,” No. 12, p. 98.

Spectrum Elektrotechnik GmbH
“Multipin Connectors for a Wide Variety of Environments,” No. 3, p. 34.

SV Microwave
“Sealed Floating Blindmate Connector,” No. 3, p. 30.

Tecdia
“Bias-T Up to 100 W and 7 GHz for GaN,” No. 11, p. 108.

Teledyne Reynolds
“Phase Matched Microwave Cable,” No. 3, p. 38.

Thales Electron Devices
“Ka-band Traveling Wave Tube: 500 W Peak, 350 W CW,” No. 8, p. 76.

TriQuint Semiconductor
“1 W GaAs MMIC Amplifier for 18 GHz Cellular Backhaul Applications,” No. 4, p. 242.

United Monolithic Semiconductors SAS
“T/R Module Solution for X-band Phased-array Radar,” No. 10, p. 146.

WIN Semiconductor Corp.
“0.1 um PHEMT for E-band Power Applications,” No. 12, p. 36.

SPECIAL REPORTS

Ditore, F. and R. Cutler
“The Coming of Age of the Software Communications Architecture,” No. 7, p. 82.

Hindle, Pat
“M/A-COM is Reborn on Its 60th Birthday,” No. 4, p. 228.

HUBER + SUHNER AG
“Power Sub-miniature Connectors for Space Applications,” No. 10, p. 136.

Mumford, Richard
“Microwaves in Europe: On the Road to Recovery?,” No. 9, p. 86.

Sheffres, Carl
“William Bazzy: 1920-2009,” No. 1, p. 16.

Vye, David
“Counting the Days…,” No. 2, p. 16.

Vye, David
“The Year That Was,” No. 12, p. 16.

SUPPLEMENT FEATURES

Bienaime, Jean-Pierre
“From HSPA to LTE and Beyond: Mobile Broadband Evolution,” No. 11, p. 4.

Cebi, Haki
“A High Linearity Darlington Intermediate Frequency (IF) Amplifier for Wide Bandwidth Applications,” No. 11, p. 18.

Cotton, Simon L. and William G. Scanlon
“Millimeter-wave Stealth Radio for Special Operations Forces,” No. 8, p. 6.

Dominguez, E.M., R.F. Tigrek, M. Ruggiano, G. Lellouch and W. de Heij
“Experimental Set Up Demonstrating Combined Use of OFDM for Radar and Communications,” No. 8, p. 22.

Ilcev, St. D.
“History of Mobile Satellite Communications,” No. 8, p. 68.

Johnson, Jackie
“How Mobile Device Users are Impacting the Future of RF Front Ends,” No. 11, p. 12.

Perotoni, M., L.A. de Andrade, M.C. Rezende and H. Vieira
“3D Electromagnetic Evaluation of a Chaff Cloud,” No. 8, p. 38.

Pino, Paul
“Comparison of VNA and TDR Measurement Uncertainty Using Coaxial Cables,” No. 3, p. 16.

Raha, Josh
“BAW Innovation Helps WiFi and 4G to Happily Coexist,” No. 11, p. 27.

Rehorn, Chris
“InP HBT Chipset, Enabling High-Bandwidth, Real-time Oscilloscope Architecture,” No. 8, p. 46.

Schwartz, Raymond and Peter Waltz
“Coaxial Cable Power Handling,” No. 3, p. 26.

Winebrand, Mark, John Aubin and Russell Soerens
“Applications of Time Domain Processing in Antenna Measurements,” No. 8, p. 58.

Yu, Zhiqiang, Jianyi Zhou, Jianing Zhao, Teng Zhao and Wei Hong
“Design of a Broadband MIMO RF Transmitter for Next-generation Wireless Communication Systems,” No. 11, p. 22.

SYSTEMS

Caprio, S.J.
“Effects of Single-tone Spurious Responses on Signals in ESM Receivers,” No. 10, p. 64.

Lee, Jun
“Phase Locked Loop Systems Design for Wireless Infrastructure Applications,” No. 5, p. 74.

TUTORIAL SERIES

du Toit, N.D., R. Thomas, J.H. Smith, F.N. Schirk and J.A. Mogel
“Design of Solid-state, Wideband, High-power Microwave Amplifiers for Radiated Immunity Testing,” No. 7, p. 90.

Lombardi, Mark
“Add Realism to Your Test Signals with RF Channel Simulators,” No. 3, p. 72.

Maloratsky, Leo G.
“Setting Strategies for Planar Dividers/Combiners,” No. 2, p. 62.

McCarthy, Darren
“Automating Radar Measurement Tasks throughout the Lifecycle of a Radar System,” No. 1, p. 62.

Thiele, Bob and Stan Hardin
“Choosing the Optimal High Frequency Coaxial Cable,” No. 3, p. 6.