Articles Tagged with ''software''

ANSYS, a global leader in engineering simulation software, will host a special information session at the IEEE MTT-S  International Microwave Symposium (IMS2015) in room 102 BC of the Phoenix convention center on Thursday, May 21. The one hour session entitled, “Leveraging Protected IP with Encrypted 3D HFSS Components for Next Generation Wireless Design & Integration” will highlight a new patent pending capability for sharing high-fidelity electrical models used in high-frequency circuit and system simulations.

Keysight Technologies Inc. unveiled WaferPro Express 2015, a measurement software platform for the automated characterization of wafer-level devices and circuit components.

INTEGRATED Engineering Software will be presenting CHRONOS, their 3D Time Domain Electromagnetic Analysis Software and SINGULA, their 3D High Frequency Electromagnetic Analysis Software at IMS2015.

Intercept Technology Inc., a leading EDA software developer for PCB, RF and hybrid design solutions, announced the promotion of Lindy Kretchmer as marketing manager.

Tech-X Corp. will be at IMS this year presenting their software solutions for electromagnetic and particle modeling. For 10 years Tech-X has been the industry leader in microwave device simulations with their flagship software tool, VSim.

NI (formerly AWR Corp.), will showcase NI AWR software throughout the International Microwave Symposium 2015 (IMS2015) in a number of ways. A preview of V12 NI AWR Design Environment™ software, including new load-pull and antenna features, as well as ease of use, speed enhancements and third-party integration flows, will be on display inside NI booth #2431. IMS2015 runs from May 17-22 in Phoenix.

Delcross Technologies announces the release of the EMIT (Electromagnetic Interference Toolkit) Version 4 software. EMIT V4.0 combines an analysis engine that is over 100x faster than the previous release, with intuitive new RF system configuration setup and EMI margin result views. 

COMSOL, the leading provider of multiphysics simulation and analysis software, announced the opening of a new office in Moscow, Russia. The new office provides sales and support for the growing community of COMSOL Multiphysics® users in Russia. Services include local sales, technical support, training sessions, and on-site workshops, seminars and customer visits.

Maury Microwave announces the latest release of its MT930-series IVCAD measurement and modeling device characterization software, revision 3.5.

Teledyne LeCroy introduces the QPHY-USB3.1-Tx-Rx package for automated USB 3.1 transmitter (Tx) and receiver (Rx) compliance testing, characterization, and debug, creating a unique and comprehensive USB 3.1 test suite. With the new test package, USB 3.1 testing can be performed on both Gen1 (5 Gb/s) and Gen2 (10 Gb/s) devices under test according to the latest USB 3.1 specifications.