Ted Rappaport, founding director of NYU WIRELESS and a leading proponent of using the millimeter wave spectrum for wireless communications, discusses the FCC's recent rulemaking actions and technology developments that are paving the way to 5G.
Lake Shore Cryotronics will announce its new continuous wave terahertz materials characterization system at the American Physical Society March Meeting 2013. The conference, which will take place March 18 to 22 in Baltimore, is the largest physics meeting in the world, focusing on research from industry, universities, and national labs.
One of the leading suppliers of high-frequency rotary joints, castings, and waveguide components for satellite-communications (satcom) systems, Microwave Development Labs (www.mdllab.com), will be joining a host of exhibitors at one of the largest major events for satcom system developers, the Satellite 2013 Conference & Exhibition.
What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.
The European RF and microwave industry is demonstrating its support for EDI CON 2013 at every opportunity, from the conference sessions, workshop presentations and the showcasing of the latest innovations on the show floor.
CEA-Leti and Agilent Technologies will present their recent research results in the field of embedded integrated systems at the IEEE Silicon Monolithic Integrated Circuits in RF Systems (SiRF) Conference in Austin, TX, Jan. 21-23.
AWR Corp., the innovation leader in high-frequency EDA software, will showcase in Booth #7 at IEEE Radio Wireless Week 2013 the latest version of its AWR Design Environment™ with many new features and enhancements specifically developed for high-frequency wireless design.
RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency components, will host a conference call to review fiscal 2013 third quarter financial results on Tuesday, January 22, 2013, at 5:00 p.m. (ET).
Recognized throughout the semiconductor and electronic design industries as the premiere annual trade event, DesignCon 2013 is scheduled for January 28-31 in Santa Clara, Calif. Hosted by UBM Electronics, the daily source of essential business and technical information for the electronics industry’s decision makers, the 14-track technical DesignCon conference program will include more than 100 in-depth tutorials, technical paper sessions and panel discussions.
The International Telemetering Conference (ITC) will be held in San Diego, CA at the Town and Country Resort from October 22nd thru October 25th, 2012. ITC/USA is sponsored by the International Foundation for Telemetering (IFT), a non-profit corporation dedicated to serving the technical and professional interests of the telemetering community.