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Articles Tagged with ''conference''

AWR to sponsor and exhibit at EDI CON 2013

February 26, 2013

What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.


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MDL shows satcom waveguide components at Satellite 2013

March 5, 2013

One of the leading suppliers of high-frequency rotary joints, castings, and waveguide components for satellite-communications (satcom) systems, Microwave Development Labs (www.mdllab.com), will be joining a host of exhibitors at one of the largest major events for satcom system developers, the Satellite 2013 Conference & Exhibition.


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Lake Shore to launch THz materials characterization system

March 6, 2013

Lake Shore Cryotronics will announce its new continuous wave terahertz materials characterization system at the American Physical Society March Meeting 2013. The conference, which will take place March 18 to 22 in Baltimore, is the largest physics meeting in the world, focusing on research from industry, universities, and national labs.


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MDL shows satcom waveguide components at Satellite 2013

March 8, 2013

Microwave Development Labs Inc. (www.mdllab.com), one of the leading suppliers of high-frequency rotary joints, castings, and waveguide components for satellite-communications (satcom) systems, will be joining a host of exhibitors at one of the largest major events for satcom system developers, the Satellite 2013 Conference & Exhibition. The Conference is scheduled for March 18-21, 2013 while the Exhibition, with more than 350 companies already registered, will run from March 19-21, 2013.


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EDI CON 2013: First-ever Electronic Design Innovation Conference Deemed a Huge Success

March 19, 2013

EDI CON 2013 - High-frequency electronic design engineers converged for learning and networking opportunities in Beijing. The event drew in excess of 2,000 attendees including over 1,100 unique conference delegates, over 800 visitors and exhibitors and more than 30 members of the press.


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Analog Devices announces Design Conference 2013

March 28, 2013

Analog Devices Inc., in collaboration with Xilinx® Inc. and MathWorks Inc., is launching a series of design conferences for analog, mixed-signal and embedded systems engineers. Based on the theme “Discuss. Design. Deliver.,” the conferences will bring together experts in high-performance analog, field-programmable gate arrays (FPGA) and modeling tools to present complete signal chain and system-ready solutions for complex design challenges.


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WIMA announces 7th NFC Applications, Hardware and Use Cases Congress in Monaco

March 29, 2013

WIMA, the leading global conference and exhibition dedicated to near field communication (NFC), announced the 7th WIMA NFC MONACO will be held from 10 - 12 April at the Grimaldi Forum in Monaco. NFC industry leaders, start-up companies, developers, solution and hardware providers will come together with end users and brands for networking and partnering to drive forward business and innovation within the NFC ecosystem.


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Richardson RFPD at M2M Zone at CTIA Wireless 2013

April 24, 2013

Richardson RFPD Inc. announces its attendance and participation at the M2M Zone at CTIA Wireless 2013. Presented by CTIA – The Wireless Association®, CTIA is a large wireless communications conference and exhibition that includes service operators, retailers, distributors, application providers, and more. The M2M Zone Conference and Pavilion showcases those companies in the dynamic M2M (machine-to-machine) segment of wireless communications.


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ARMMS conference celebrates 30 years with record attendance

April 29, 2013

The ARMMS RF & Microwave Society celebrated its 30thanniversary with a record attendance at its Teledyne Microwave Solutions sponsored April meeting, held near Oxford, UK, exceeding the previous record set in 2005.


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