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Articles Tagged with ''conference''
Advantech Wireless Inc., a privately-held Canadian corporation and manufacturer of satellite, RF equipment and microwave systems will present details of its UltraLinear™ GaN based SSPA Systems at the Satellite 2014 show and conference that will take place March 11th through March 13th, in the Walter E. Washington Convention Center, Washington, DC.
Richardson RFPD Inc. announced its sponsorship of the Electronic Design Innovation Conference (EDI CON) 2014 GaN Panel.
Richardson RFPD Inc.has announced its Gold-level sponsorship of the Electronic Design Innovation Conference (EDI Con 2014) to be held at the Beijing International Convention Center, Beijing, China, April 8-10, 2014. As a gold sponsor, Richardson RFPD will organize a special expert forum discussing the state-of-the-art in Gallium Nitride (GaN) semiconductor technology targeting high-power RF and microwave applications. As the sponsor, Richardson RFPD has assembled a panel of experts from leading suppliers of discrete transistors and integrated circuits based on GaN technology.
UBM Tech, the daily source of essential business and technical information for decision makers in the electronics industry, held its annual DesignCon conference and expo last week in Santa Clara, CA. Met with enthusiastic industry reception, DesignCon 2014 was attended by more than 5,000 members of the chip, package, board and systems design communities.
With space budgets tighter than ever, Space Tech Conference 2014 will bring together key military personnel, government officials and private industry executives to discuss the pressing issues facing the space industry during April 1-3, 2014 in Long Beach, California.
EDI CON 2014 has announced that Dr. Song Junde, professor at the Beijing University of Posts and Telecommunications, will serve as the chairman emeritus of the second annual technical conference and trade exposition focused on RF, microwave and high-speed digital design. Junde, who held the role of honorary chair for the inaugural EDI CON in March of 2013, will once again provide guidance to the event organizers and technical program planning committee in the development of a technical conference focused on advancing microwave technology and the communications industry in China.
UBM Tech, the daily source of essential business and technical information for decision makers in the electronics industry, will welcome thousands of influential members of the chip, package and board design communities to DesignCon 2014, January 28 – 31, at the Santa Clara Convention Center in Santa Clara, California. Recognized as the premier annual trade event and technical conference dedicated to the pervasive nature of signal integrity at all levels of electronic design, DesignCon will host Keynote Speakers from Intel, Micron Technologies and XPRIZE.
Computer Simulation Technology (CST), Darmstadt, announces winners of the CST University Publication Award 2013, an annual grant to university institutes and researchers for published papers related to 3D electromagnetic field simulation applications.
Horizon House Publications and Microwave Journal China announced the participation of RFHIC, a global leader in the design and manufacture of RF & Microwave components, as a Gold sponsor of the 2014 Electronic Design Innovation Conference (EDI CON 2014) to be held April 8–10, 2014 at the Beijing International Convention Center in Beijing, China.