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Articles Tagged with ''package''
Custom MMIC's thermal analysis calculator estimates accurate "package bottom" temp based on PCB construction
Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits (MMICs), is introducing a free, easy-to-use, Thermal Analysis tool to their array of web-based calculators. The company offers Attenuator, Image Rejection, Cascade Analysis, and now Thermal calculators.
L-3 TRL Technology and Avanti Communications to provide secure high-speed Ka-Band satellite services
L-3 TRL Technology (L-3 TRL) announced that it is working with Avanti Communications to provide secure Ka-Band satellite services to government and military agencies that use L-3 TRL’s CATAPAN® encryption devices for direct high-speed connectivity. Coverage includes parts of Europe, the Middle East, the Caucasus region and Africa.
Linear Technology announces the LT3795, a 110V, high-side current sense DC/DC converter designed to regulate a current or voltage to a constant value, ideal for driving high brightness (HB) LEDs. Its 4.5V to 110V input voltage range makes it appropriate for a wide variety of applications, including automotive, industrial and architectural lighting. The LT3795 uses an external low side N-channel MOSFET and can drive up to 90V of white LEDs from a nominal 12V input, delivering in excess of 50 watts.
Richardson RFPD Inc. and Wavelex announces immediate availability and full design support capabilities for two new low noise amplifiers (LNAs) from Wavelex.
KCB Solutions is pleased to announce a new suite of SPST through SP6T switches designed to meet high power-handling requirements from 50 to 200 Watts. These switches are available in QFN-style packages and thermally conductive flange-mount packages.
RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency solutions, today introduced the RFHA1027, a gallium nitride (GaN) matched power transistor (MPT) that will deliver industry-leading pulse power performance of 500W in a compact flanged package at L-Band.
Continuing to build momentum and recognition for their “Size Matters” HPA platforms, Empower RF Systems is hosting live demonstrations of their 1 kW, 20 to 1000 MHz, 5U chassis design (model 2162) at IMS 2013, Booth 1827.
Texas Instruments Inc. (TI) introduced the industry’s fastest 4-channel, 14-bit analog-to-digital converter (ADC), clocking in at 250 MSPS. The high-density ADS4449 enables receiver systems to support up to 125 MHz of instantaneous bandwidth in extremely small forms, such as multiple input and multiple output (MIMO) base stations and munitions guidance, or in greater density applications, such as active electrically scanned array (AESA) and other phased-array radars.
TriQuint Semiconductor Inc., a leading RF solutions supplier and technology innovator, announced 15 new gallium nitride (GaN) amplifiers and transistors along with two new GaN processes. These products offer performance, size and durability advantages for communications, radar and defense RF systems. TriQuint innovation will be displayed at the IEEE IMS / MTT-S convention and exhibition in Seattle, Washington, June 4-6, Booth 530.
CTS Electronic Components Inc. announces development of Model 148, oven controlled crystal oscillator (OCXO), which use the unique SC cut crystal technology to significantly reduce power consumption (0.23W at +25ºC) and allow for additional board space with its miniature-sized package.