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Articles Tagged with ''package''
KCB Solutions is pleased to announce a new suite of SPST through SP6T switches designed to meet high power-handling requirements from 50 to 200 Watts. These switches are available in QFN-style packages and thermally conductive flange-mount packages.
RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency solutions, today introduced the RFHA1027, a gallium nitride (GaN) matched power transistor (MPT) that will deliver industry-leading pulse power performance of 500W in a compact flanged package at L-Band.
Continuing to build momentum and recognition for their “Size Matters” HPA platforms, Empower RF Systems is hosting live demonstrations of their 1 kW, 20 to 1000 MHz, 5U chassis design (model 2162) at IMS 2013, Booth 1827.
Texas Instruments Inc. (TI) introduced the industry’s fastest 4-channel, 14-bit analog-to-digital converter (ADC), clocking in at 250 MSPS. The high-density ADS4449 enables receiver systems to support up to 125 MHz of instantaneous bandwidth in extremely small forms, such as multiple input and multiple output (MIMO) base stations and munitions guidance, or in greater density applications, such as active electrically scanned array (AESA) and other phased-array radars.
TriQuint Semiconductor Inc., a leading RF solutions supplier and technology innovator, announced 15 new gallium nitride (GaN) amplifiers and transistors along with two new GaN processes. These products offer performance, size and durability advantages for communications, radar and defense RF systems. TriQuint innovation will be displayed at the IEEE IMS / MTT-S convention and exhibition in Seattle, Washington, June 4-6, Booth 530.
CTS Electronic Components Inc. announces development of Model 148, oven controlled crystal oscillator (OCXO), which use the unique SC cut crystal technology to significantly reduce power consumption (0.23W at +25ºC) and allow for additional board space with its miniature-sized package.
Lark offers a full line of ultra-thin filters for commercial and military markets. Lark’s new ultra-thin package offers superior performance in less than 0.09” high package with low insertion loss and ultimate rejection levels of 60 dB while maintaining better than 1.5:1 VSWR. Units are lightweight and ruggedized for today’s AIR, SEA & LAND applications.
TI announced two new software packages for its KeyStone-based multicore system-on-chips (SoCs): a new production ready small cell Physical (PHY) software package and a transport software package for wireless and other network-oriented applications.
Linear Technology announces the LTC6090, a precision operational amplifier that operates on a supply voltage up to 140 V (or ±70 V). Its combination of rail-to-rail output, 3 pA (typical) input bias current, 1.6 mV maximum input offset voltage and 3.5 µVP-P low frequency noise delivers the precision required for high performance ATE, piezo driver, and DAC buffer applications.
Richardson RFPD Inc. announces immediate availability and full design support capabilities for new package options on an RF power LDMOS transistor from Freescale Semiconductor Inc. (Freescale).