Ted Rappaport, founding director of NYU WIRELESS and a leading proponent of using the millimeter wave spectrum for wireless communications, discusses the FCC's recent rulemaking actions and technology developments that are paving the way to 5G.
M/A-COM Technology Solutions Inc., a leading supplier of high-performance analog, RF, microwave and optical semiconductor products, today announced the new M02027, next generation high-performance TIA targeted for GPON optical network unit (ONU) equipment.
Mercury Systems, Inc., will join an elite group of defense industry leaders at Defense Innovation Days, Aug. 26-28, 2015, in Newport, R.I. Presented by the Southeastern New England Defense Industry Alliance (SENEDIA), the conference unites organizations developing cutting-edge technology and policymakers helping steer the nation’s defense strategy.
Harris Corp. and Exelis, Inc. announced a definitive agreement under which Harris will acquire Exelis in a cash and stock transaction valued at $23.75 per share, or an approximately $4.75 billion enterprise value. The agreement has been unanimously approved by the boards of directors of both companies. The transaction is expected to close in June 2015 and is subject to customary closing conditions, including regulatory and Exelis shareholder approval.
Intercept Technology Inc., a leader in PCB/Hybrid/RF electrical engineering applications, launched an enhanced bidirectional link between Intercept's Mozaix schematic and Pantheon layout design applications and Agilent's ADS software. By utilizing Agilent's enhanced ADS Board Link (ABL) data transfer format, Intercept leads the way to a streamlined PCB integration with greater flexibility of data transfer and easier management of data integrity.
MACOM will showcase the industry's broadest GaN product portfolio at IMS2014 in Tampa, Florida, at booth 915. MACOM will also feature a suite of new products aimed at applications spanning industrial, scientific, medical, point-to-point wireless and X-Band radar.
Agilent Technologies Inc. introduced two new interposer solutions for testing DDR4 and DDR3 DRAM designs with a logic analyzer. Both interposer solutions provide fast, accurate capture of address, command and data signals for debugging designs and making validation measurements.
M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, will showcase the industry's broadest GaN product portfolio at IMS 2014 in Tampa, Florida, at booth 915.
AWR Corp. announces that the popular AWR Design Forum kicks off its fourth annual tour on July 11, 2014 in Tokyo, Japan. Additional locations in the Asia Pacific region, including China and Taiwan are set for September.