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RF Micro Devices Inc. announced it has begun production shipments of its ultra-high efficiency power amplifiers to Samsung in support of the highly anticipated next-generation Galaxy S3 4G LTE smartphone.
RF Micro Devices Inc. (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced it has begun production shipments of its ultra-high efficiency power amplifiers to Samsung in support of the highly anticipated next-generation Galaxy S3 4G LTE smartphone.
Comtech Xicom Technology Inc. announces a new, compact, LCD touch screen controller for HPAs. The new LCD touch screen provides an easy-to-use interface for monitoring and controlling multiple amplifiers and switches.
Hittite Microwave Corp. launched three new GaAs pHEMT MMIC power amplifiers which cover the 9 to 14 GHz frequency range and are ideal for microwave radio, military and space, SATCOM and test and measurement applications.
Advantech Wireless, a Canadian-based manufacturer of broadcast-quality Satellite, RF Equipment and Microwave Systems announces the release of a new series of indoor, GaN technology based solid state power amplifiers (SSPAs) and BUCs featuring high power, high linearity and a compact size. Named the Super Compact SG Series, the high power amplifiers can easily replace old technology and inefficient TWTAs, offering enormous cost saving and reduce operating costs. The units practically pay for themselves in a short time.
The wireless sensor network market, led by ZigBee, grew ten-fold from 2007 to 2010 and exceeded 45 million annual shipments in 2011. “Strong growth is expected for 2012 and beyond as ZigBee pervades the home automation and home entertainment markets, whilst Smart Meters continue to be rolled out across the globe,” commented Peter Cooney, wireless connectivity practice director.
Richardson RFPD Inc. announces immediate availability and full design support capabilities of a new 30 W GaN power amplifier from TriQuint Semiconductor Inc. (TriQuint).
Agilent Technologies Inc. unveiled ADS 2012, the next major release of its Advanced Design System (ADS) flagship RF and microwave EDA platform.
Linear Technology’s Dust Networks® product group introduces the SmartMesh™ LTC5800 (system-on-chip) and LTP5900 (module) families, the industry’s lowest power IEEE 802.15.4E compliant wireless sensor networking products. SmartMesh ICs and modules enable tiny sensor “motes” to be designed with a battery life of over 10 years, while companion network manager components enable the development of highly robust and secure wireless sensor networks (WSN).
Aethercomm Inc., has recently completed a high power SSPA using a Gallium Nitride (GaN) with a frequency range covering 2.9 to 3.1 GHz: Aethercomm part number SSPA 2.9-3.1-300. The devices in this amplifier design are not matched, therefore the frequency band is scalable from 2.7 to 2.9 GHz or 2.7 to 3.5 GHz with similar performance. This high power SSPA produces 300 to 400 watts peak output power.
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