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Articles Tagged with ''power''

TriQuint’S new GaN transistors deliver superior gain, can reduce amplifier size 50%

October 29, 2012

TriQuint Semiconductor Inc., a leading RF products manufacturer and foundry services provider, is introducing four new rugged GaN HEMT RF power transistors that offer superior gain and efficiency. TriQuint’s GaN transistors can cut the size of amplifier line-ups in half while improving efficiency and gain.


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ADI expands its Microwave IC product portfolio with new family of high performance VCOs

October 29, 2012

Analog Devices Inc. introduced a new family of microwave ICs, the ADF55xx series voltage controlled oscillators (VCOs), for point-to-point (PtP), instrumentation/ test equipment and satellite communication applications. Featuring the industry’s leading phase-noise performance, the new ADF55xx VCO series covers a frequency range from 3.5 GHz to 13.9 GHz, offers a wide frequency tuning range and can be optimized for power consumption, phase noise and power output.


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Linear introduces lowest noise, 16-Bit 20 Msps ADCs that achieve 84 dB SNR

October 26, 2012

Linear Technology Corp. introduces three low power 16-bit, 20Msps analog-to-digital converters (ADCs), the LTC2269, LTC2270 and LTC2271, offering the lowest input-referred noise and tight integral nonlinearity error (INL) for very high precision DC measurements. With only 46µVRMS input noise and maximum guaranteed INL error of ±2.3LSB, these ADCs are suitable for very low noise, high linearity sampling applications such as digital x-ray, infrared and medical imaging, pachymeters, spectrometry and cytometry.


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Florida RF Labs introduces broadband resistive power dividers

October 24, 2012

Florida RF Labs has added broadband resistive power dividers to the HybriX® line of signal distribution products. The new RPD series offers significant advantages over on-board multi-resistor design by providing excellent broadband frequency response, highly repeatable performance, and streamlined assembly process in a monolithic surface-mountable chip package.


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Cree and Array Wireless provide HD broadcast equipment for NBC's Sunday Night Football

October 19, 2012

Cree Inc. and Array Wireless help bring the clarity of high-definition (HD) video transmission to Sunday Night Football (SNF) on NBC. The HD NFL games are broadcast using wireless video systems from Array Wireless that employ Cree’s advanced GaN RF components. Array Wireless counts on Cree world-class RF GaN technology to create high efficiency, low distortion, robust power amplifiers that are essential for high-definition video transmission.


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ERZIA to present space and Hi Rel products catalog at EuMW 2012

October 17, 2012

ERZIA Space´s line of products, especially focused on power amplifiers, will be presented during the 15th edition of the European Microwave Week. Visit the company at Stand 302.


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TriQuint releases 1st return path DOCSIS amplifier for channel bonding in HFC networks

MMICs&More
October 12, 2012

TriQuint Semiconductor Inc. has introduced three new devices for CATV infrastructure and fiber to the premises (FTTP) applications, including the industry’s first amplifier supporting return path DOCSIS® 3.0 channel bonding with 5 to 300 MHz bandwidth.


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Nujira samples low noise second-generation envelope tracking chip for smartphones

October 11, 2012

Nujira Ltd., the world leader in envelope tracking (ET) technology, has announced that is sampling its next generation ET IC for mobile handsets, the NCT-L1200, to lead partners. The second product in its Coolteq.L ET product family, Nujira’s NCT-L1200 has already been delivered to several key platform chipset vendors, and is the only product currently available on the market that supports the maximum 20MHz channel bandwidth of LTE.


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Aethercomm introduces a high power GaN SSPA

October 9, 2012

Aethercomm Inc., has recently completed a high power SSPA using a Gallium Nitride (GaN) with a frequency range covering 2.9 to 3.1 GHz: Aethercomm part number SSPA 2.9-3.1-300. The devices in this amplifier design are not matched, therefore the frequency band is scalable from 2.7 to 2.9 GHz or 2.7 to 3.5 GHz with similar performance. This high power SSPA produces 300 to 400 watts peak output power.


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Linear's WirelessHART and IP WSNs achieve industry’s lowest power consumption

October 9, 2012

Linear Technology’s Dust Networks® product group introduces the SmartMesh™ LTC5800 (system-on-chip) and LTP5900 (module) families, the industry’s lowest power IEEE 802.15.4E compliant wireless sensor networking products. SmartMesh ICs and modules enable tiny sensor “motes” to be designed with a battery life of over 10 years, while companion network manager components enable the development of highly robust and secure wireless sensor networks (WSN).


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