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Articles Tagged with ''power''
Florida RF Labs has added broadband resistive power dividers to the HybriX® line of signal distribution products. The new RPD series offers significant advantages over on-board multi-resistor design by providing excellent broadband frequency response, highly repeatable performance, and streamlined assembly process in a monolithic surface-mountable chip package.
Cree Inc. and Array Wireless help bring the clarity of high-definition (HD) video transmission to Sunday Night Football (SNF) on NBC. The HD NFL games are broadcast using wireless video systems from Array Wireless that employ Cree’s advanced GaN RF components. Array Wireless counts on Cree world-class RF GaN technology to create high efficiency, low distortion, robust power amplifiers that are essential for high-definition video transmission.
ERZIA Space´s line of products, especially focused on power amplifiers, will be presented during the 15th edition of the European Microwave Week. Visit the company at Stand 302.
TriQuint Semiconductor Inc. has introduced three new devices for CATV infrastructure and fiber to the premises (FTTP) applications, including the industry’s first amplifier supporting return path DOCSIS® 3.0 channel bonding with 5 to 300 MHz bandwidth.
Nujira Ltd., the world leader in envelope tracking (ET) technology, has announced that is sampling its next generation ET IC for mobile handsets, the NCT-L1200, to lead partners. The second product in its Coolteq.L ET product family, Nujira’s NCT-L1200 has already been delivered to several key platform chipset vendors, and is the only product currently available on the market that supports the maximum 20MHz channel bandwidth of LTE.
Aethercomm Inc., has recently completed a high power SSPA using a Gallium Nitride (GaN) with a frequency range covering 2.9 to 3.1 GHz: Aethercomm part number SSPA 2.9-3.1-300. The devices in this amplifier design are not matched, therefore the frequency band is scalable from 2.7 to 2.9 GHz or 2.7 to 3.5 GHz with similar performance. This high power SSPA produces 300 to 400 watts peak output power.
Linear Technology’s Dust Networks® product group introduces the SmartMesh™ LTC5800 (system-on-chip) and LTP5900 (module) families, the industry’s lowest power IEEE 802.15.4E compliant wireless sensor networking products. SmartMesh ICs and modules enable tiny sensor “motes” to be designed with a battery life of over 10 years, while companion network manager components enable the development of highly robust and secure wireless sensor networks (WSN).
Agilent Technologies Inc. unveiled ADS 2012, the next major release of its Advanced Design System (ADS) flagship RF and microwave EDA platform.
Richardson RFPD Inc. announces immediate availability and full design support capabilities of a new 30 W GaN power amplifier from TriQuint Semiconductor Inc. (TriQuint).
The wireless sensor network market, led by ZigBee, grew ten-fold from 2007 to 2010 and exceeded 45 million annual shipments in 2011. “Strong growth is expected for 2012 and beyond as ZigBee pervades the home automation and home entertainment markets, whilst Smart Meters continue to be rolled out across the globe,” commented Peter Cooney, wireless connectivity practice director.