Soitec (Euronext) and SunEdison Inc. announced that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products. The agreement provides each company with access to the other’s patent portfolio for SOI technologies and ends all outstanding legal disputes between the companies.
Integrated Microwave Technologies LLC (IMT), a business unit within the Vitec Group’s Videocom division, and a leader in advanced digital microwave systems for MAG (military, aerospace & government) markets, is pleased to announce that Brian Rowe has been appointed business development manager for its Intelligence, Surveillance and Reconnaissance (ISR) programs.
The Boeing Co. and Lockheed Martin Corp. are teaming to compete for the United States Air Force’s Long-Range Strike Bomber program, with Boeing acting as the prime contractor and Lockheed Martin as the primary teammate.
Raytheon Co. has been awarded a $385,742,176 cost-plus-incentive-fee contract for the engineering and modeling development phase design, development, integration, test and delivery of Air and Missile Defense S-Band Radar (AMDR-S) and Radar Suite Controller (RSC). AMDR is the Navy's next generation integrated air and missile defense radar and is being designed for Flight III Arleigh Burke (DDG 51) class destroyers beginning in 2016.
DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications. The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.
Richardson RFPD, Inc. today announced the online availability of videos of the presentations from the leading innovators and suppliers of RF, Wireless & Energy Technologies that the company hosted at its booth at the International Microwave Symposium (IMS) 2013 in Seattle.
After obtaining ISO 13485 certification in 2012 for medical devices, and in order to respond to the growing demand of customers in the medical and Hi-Rel applications, IPDiA unveils its ability to offer advanced foundry services.
To simplify the development of ZigBee® wireless connectivity-enabled smart energy infrastructure, home and building automation and intelligent lighting gateways, Texas Instruments Inc. (TI) announced the availability of the CC2538 system-on-chip (SoC). The industry’s most integrated ZigBee solution, the CC2538 is cost-efficient with an ARM® Cortex™-M3 MCU, memory and hardware accelerators on one piece of silicon.