Raytheon Co. has received a resume work order from the U.S. Navy to commence development of the new Air and Missile Defense Radar. The order followed the official Government Accountability Office update of its database to reflect the status of the AMDR contract award protest as withdrawn.
The Federal Aviation Administration (FAA) announced that Nevada has been selected as one of six locations to be a center for unmanned aerial vehicle (UAV) development in the United States. As a UAV development site, the most likely economic forecast shows that there could be thousands of jobs for UAS direct employees with an average wage of approximately $62,000; an estimated $2.5 billion in economic impact in present dollars; and an estimated $125 million in annual state and local tax revenue.
Soitec (Euronext) and SunEdison Inc. announced that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products. The agreement provides each company with access to the other’s patent portfolio for SOI technologies and ends all outstanding legal disputes between the companies.
Integrated Microwave Technologies LLC (IMT), a business unit within the Vitec Group’s Videocom division, and a leader in advanced digital microwave systems for MAG (military, aerospace & government) markets, is pleased to announce that Brian Rowe has been appointed business development manager for its Intelligence, Surveillance and Reconnaissance (ISR) programs.
The Boeing Co. and Lockheed Martin Corp. are teaming to compete for the United States Air Force’s Long-Range Strike Bomber program, with Boeing acting as the prime contractor and Lockheed Martin as the primary teammate.
Raytheon Co. has been awarded a $385,742,176 cost-plus-incentive-fee contract for the engineering and modeling development phase design, development, integration, test and delivery of Air and Missile Defense S-Band Radar (AMDR-S) and Radar Suite Controller (RSC). AMDR is the Navy's next generation integrated air and missile defense radar and is being designed for Flight III Arleigh Burke (DDG 51) class destroyers beginning in 2016.
DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications. The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.