advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

Articles Tagged with ''development''

Raytheon awarded U.S. Navy next gen Air and Missile Defense Radar contract

Raytheon Co. has been awarded a $385,742,176 cost-plus-incentive-fee contract for the engineering and modeling development phase design, development, integration, test and delivery of Air and Missile Defense S-Band Radar (AMDR-S) and Radar Suite Controller (RSC). AMDR is the Navy's next generation integrated air and missile defense radar and is being designed for Flight III Arleigh Burke (DDG 51) class destroyers beginning in 2016.


Read More

DuPont Circuit & Packaging Materials and IQLP to develop high-speed circuit technology

DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications.  The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.


Read More

TI delivers industry's most integrated ZigBee single-chip solution with an ARM Cortex-M3 MCU

To simplify the development of ZigBee® wireless connectivity-enabled smart energy infrastructure, home and building automation and intelligent lighting gateways, Texas Instruments Inc. (TI) announced the availability of the CC2538 system-on-chip (SoC). The industry’s most integrated ZigBee solution, the CC2538 is cost-efficient with an ARM® Cortex™-M3 MCU, memory and hardware accelerators on one piece of silicon.


Read More

Hesse launches heavy wire and ribbon bonding services for product development

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.


Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement