Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Electronic Components and Technology Conference (ECTC) May 27-30 in Lake Buena Vista, Florida.
API Technologies Corp., a leading provider of high performance RF/microwave, power, and security solutions for critical and high-reliability applications, announced the receipt of a strategic development order for a multi-channel microwave front end system. This integrated microwave assembly (IMA) will be used in a next generation radar warning receiver targeted for use in major Department of Defense military aircraft platforms.
Altium Limited, a global leader in Smart System Design Automation, 3D PCB design (Altium Designer) and embedded software development (TASKING) has announced that it intends to begin a corporate reorganization to best serve the needs of their customers and partners in key growth markets.
Raytheon Co. successfully completed a passive seeker test designed for a Tomahawk Block IV cruise missile using company-funded independent research and development investment. The captive flight test, using a modified Tomahawk Block IV missile nose cone, demonstrated that Raytheon's advanced, next-generation; multi-function processor can enable the cruise missile to navigate to and track moving targets emitting radio frequency signals.
Anite, a global leader in wireless equipment testing technology, announced that it is first to offer chipset and device manufacturers the ability to verify their 4x4 Downlink (DL) MIMO designs and products, accelerating the development of LTE and LTE-Advanced devices. The milestone was achieved in close collaboration with a leading device manufacturer using Anite’s Development Toolset - an easy to use solution for early stage testing..
Indium Corp.’s Dr. Ning-Cheng Lee, vice president of technology, Dr. Yan Liu, research chemist, Joanna Keck, research technician and Erin Page, research technician, were awarded Honorable Mention for their paper "Voiding and Drop Test Performance of Lead-Free Low-Melting and Medium-Melting Mixed Alloy BGA Assembly" at the opening ceremony of the IPC APEX Expo on March 25.
Prototype device testing shows that GE’s RF MEMS switch can help enable increased data transfer speeds, enhanced signal quality, longer battery life, and the advanced RF designs required of LTE-Advanced devices.