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Articles Tagged with ''development''
The Federal Communications Commission is soliciting public comments on an IEEE-USA petition asking the federal government to classify frequency spectrum above 95 GHz as “a new technology or service.”
The Boeing Co. and Lockheed Martin Corp. are teaming to compete for the United States Air Force’s Long-Range Strike Bomber program, with Boeing acting as the prime contractor and Lockheed Martin as the primary teammate.
Raytheon Co. has been awarded a $385,742,176 cost-plus-incentive-fee contract for the engineering and modeling development phase design, development, integration, test and delivery of Air and Missile Defense S-Band Radar (AMDR-S) and Radar Suite Controller (RSC). AMDR is the Navy's next generation integrated air and missile defense radar and is being designed for Flight III Arleigh Burke (DDG 51) class destroyers beginning in 2016.
DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications. The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.
Richardson RFPD video presentations by leading innovators and suppliers of RF, wireless & energy technologies
Richardson RFPD, Inc. today announced the online availability of videos of the presentations from the leading innovators and suppliers of RF, Wireless & Energy Technologies that the company hosted at its booth at the International Microwave Symposium (IMS) 2013 in Seattle.
Johanson Manufacturing is pleased to announce the appointment of Brian Rowe as vice president of sales. Rowe has been in the RF and Microwave Industry for more than 25 years.
IPDiA extends its scope and offers semiconductor process optimization and transfer applied to medical and Hi-Rel applications
After obtaining ISO 13485 certification in 2012 for medical devices, and in order to respond to the growing demand of customers in the medical and Hi-Rel applications, IPDiA unveils its ability to offer advanced foundry services.
To simplify the development of ZigBee® wireless connectivity-enabled smart energy infrastructure, home and building automation and intelligent lighting gateways, Texas Instruments Inc. (TI) announced the availability of the CC2538 system-on-chip (SoC). The industry’s most integrated ZigBee solution, the CC2538 is cost-efficient with an ARM® Cortex™-M3 MCU, memory and hardware accelerators on one piece of silicon.
Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.