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Articles Tagged with ''development''
GE MEMS switch technology demonstrates performance which could meet demands for next-generation “True 4G” mobile devices
Southwest Microwave is pleased to announce the appointment of Donald Bradfield as the new general manager for its Microwave Products Division.
Computer Simulation Technology (CST), Darmstadt, announces a new office in Warsaw, Poland, strengthening the sales and support channels for its electromagnetic (EM) simulation tools in the Baltic region.
In 1999, within the pristine walls of Raytheon’s acclaimed microchip foundry in Andover, MA, engineers covered from head to toe in white protective suits first began their research into a promising new technology: gallium nitride.
For those engaged in R&D of next generation products, incorporating millimeter wave components into broader designs is facilitated by partnering with established industrial experts that have already spent decades in the design, development, and testing of such systems.
Raytheon Co. has received a resume work order from the U.S. Navy to commence development of the new Air and Missile Defense Radar. The order followed the official Government Accountability Office update of its database to reflect the status of the AMDR contract award protest as withdrawn.
The Federal Aviation Administration (FAA) announced that Nevada has been selected as one of six locations to be a center for unmanned aerial vehicle (UAV) development in the United States. As a UAV development site, the most likely economic forecast shows that there could be thousands of jobs for UAS direct employees with an average wage of approximately $62,000; an estimated $2.5 billion in economic impact in present dollars; and an estimated $125 million in annual state and local tax revenue.
Georg Schmidt, CEO and CVO of eesy-ic, announced that he has transferred the technical management of eesy-ic to Dr. Frank Ohnhäuser (CTO and CEO).
Soitec (Euronext) and SunEdison Inc. announced that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products. The agreement provides each company with access to the other’s patent portfolio for SOI technologies and ends all outstanding legal disputes between the companies.