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Articles Tagged with ''exhibition''

EDI CON expands exhibition space to meet high demand

Second exhibition hall at CNCC in Beijing opens up premier booth spaces

Horizon House Publications and Microwave Journal China are pleased to announce that EDI CON 2015, taking place April 14-16, has expanded into a second exhibition hall. Exhibitors can choose from a range of booth sizes and packages that can include commercial technical sessions or workshops to maximize lead generation and brand exposure.


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North American debut of first ever hybrid milling/laser prototyping system by LPKF

Attendees of the 2014 International Microwave Symposium (IEEE-IMS) Exhibition will have the opportunity to see printed circuit boards made live and in-person by visiting LPKF Laser & Electronics in booth #1108. LPKF has announced that they will be debuting the first ever hybrid milling/laser prototyping system, the ProtoMat D104. Also at the show will be a UV laser prototyping system, the ProtoLaser U3. The show will be hosted in Tampa, FL., June 3-5 at the Tampa Convention Center.


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EDI CON 2014 opening ceremonies to discuss electronics driving next generation telecommunications and security systems

The Electronic Design Innovation Conference (EDI CON), the industry-driven event for RF, microwave and high speed digital electronic designers to be held April 8-10 at the Beijing International Convention Center will present an opening plenary session emphasizing future communication and aerospace/defense systems made possible through advanced high-frequency ICs.


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RFHIC joins EDI CON 2014 as a Gold sponsor

Leading GaN-based RF power amplifier manufacturer will share its expertise in wideband, high performance devices with Chinese designers and wireless infrastructure system integrators

Horizon House Publications and Microwave Journal China announced the participation of RFHIC, a global leader in the design and manufacture of RF & Microwave components, as a Gold sponsor of the 2014 Electronic Design Innovation Conference (EDI CON 2014) to be held April 8–10, 2014 at the Beijing International Convention Center in Beijing, China.


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