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Articles Tagged with ''paper''

Indium Corp.'s paper recognized with honorable mention at IPC APEX EXPO

Indium Corp.
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Indium Corp.’s Dr. Ning-Cheng Lee, vice president of technology, Dr. Yan Liu, research chemist, Joanna Keck, research technician and Erin Page, research technician, were awarded Honorable Mention for their paper "Voiding and Drop Test Performance of Lead-Free Low-Melting and Medium-Melting Mixed Alloy BGA Assembly" at the opening ceremony of the IPC APEX Expo on March 25. 


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MACOM showcasing industry's first highly integrated, plastic-packaged control MMIC for radar applications at IRSI-13

MACOM
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At this year’s International Radar Symposium India 2013 (IRSI-13), M/A-COM Technology Solutions (MACOM) will showcase a broad portfolio of new products for aerospace, defense and network applications. In addition, MACOM executives will be presenting both a plenary talk and an industrial paper presentation during the event, which will take place in Bangalore, December 12-14, 2013.


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New AWR white paper on high-frequency module design now available

AWR Corp.
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AWR Corp. offers the second in a series of white papers addressing RF/Microwave design flow issues. This latest offering, “EDA Software Design Flow Considerations for the RF/Microwave Module Designer,” outlines the steps for implementing an integrated design flow within the Microwave Office® design suite for an MCM microwave monolithic integrated circuit (MMIC) design. 


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ThinkRF receives award for best paper at IEEE AUTOTESTCON 2013

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ThinkRF announced that five of its employees have been recognized for their participation in this year’s IEEE AUTOTESTCON. AUTOTESTCON is the world’s premier conference that brings together the military/aerospace automatic test industry and government/military acquirers and users to share new technologies, discuss innovative applications, and exhibit products and services.


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Registration now open for DesignCon 2014: Where the Chip Meets the Board

DesignCon
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Recognized throughout the high-speed communications and semiconductor communities as the premier educational conference and technology exhibition for electronic design engineers working on the cutting edge of high-speed serial design and signal and power integrity, DesignCon 2014, which will take place in Santa Clara, California, January 28-31, is now open for registration.  Hosted by UBM Tech, the daily source of essential business and technical information for the electronics industry’s decision makers, the 14-track technical DesignCon conference program will include more than 120 in-depth tutorials, technical paper sessions and panel discussions. 


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New AWR white paper: Design Flow Considerations for PA MMIC Design

AWR Corp.
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A new white paper from AWR, “RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design,” examines a gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (PHEMT) power amplifier (PA) design approach from a systems perspective.


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ALMA pinpoints early galaxies at record speed

phys.org
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A team of astronomers has used the new ALMA (Atacama Large Millimeter/submillimeter Array) telescope to pinpoint the locations of over 100 of the most fertile star-forming galaxies in the early Universe. ALMA is so powerful that, in just a few hours, it captured as many observations of these galaxies as have been made by all similar telescopes worldwide over a span of more than a decade. 


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Lake Shore Cryotronics to showcase photonic material characterization at SPIE Optics and Photonics 2012

Lake Shore Cryotronics
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Lake Shore Cryotronics Inc., a manufacturer of scientific sensors, instruments, and systems for precise measurement and control, announces that it will feature its new cryogen-free cryogenic probe stations and the 8400 Series Hall effect measurement system at SPIE Optics and Photonics, August 12-16, at the San Diego Convention Center in San Diego, CA, in Booth #1122.


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White paper details PIM reduction in cables and connectors

San-tron Inc.
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San-tron Inc. has written a white paper on passive intermodulation (PIM), its effects on modern communications systems, and how it can be minimized in high-frequency cables, connectors, and cable assemblies.


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