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Articles Tagged with ''ceramic''

TriQuint’s new BAW filters provide greater power handling

February 4, 2013

TriQuint Semiconductor Inc., a leading RF solutions supplier and technology innovator, has released three new bulk acoustic wave (BAW) RF bandpass filters that can handle more power while providing greater temperature stability and superior signal rejection for high performance infrastructure applications.


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UltraSource releases new thin film microcircuit CopperVia

January 16, 2013

Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The CopperVia was first introduced at the June2012 IEEE MTT-S International Microwave Symposium/Exhibition inMontreal, Quebec, Canada.


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CTS to showcase new electronic components at electronica 2012

November 12, 2012

At electronica 2012 in Munich, Germany CTS Corp., a global leader in ceramic, quartz and piezo technologies announces they will be showcasing their latest technology. CTS’ booth is co-located with its local representatives, MRC Components and Electrade GmbH in Hall B5 Booth 337.


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CTS to showcase new electronic components at electronica 2012

November 1, 2012

At electronica 2012 in Munich, Germany CTS Corp., a global leader in ceramic, quartz and piezo technologies announced it will be showcasing its latest technology. CTS’ booth is co-located with its local representatives, MRC Components and Electrade GmbH in Hall B5 Booth 337.


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KEMET and Modelithics partner to provide RF & microwave engineers global capacitor models

October 29, 2012

KEMET Corp., a leading manufacturer of tantalum, ceramic, aluminum, film, paper and electrolytic capacitors, and Modelithics have partnered to provide highly accurate and scalable Global™ models of KEMET’s CBR Series of capacitors, sizes 0201, 0402, 0603, and 0805, for RF and microwave applications. As an innovation for this work, aimed at improved design centering, Modelithics used actual low frequency capacitance of parts used for RF model development instead of assumed nominal part value.  


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CTS Tusonix ships new high voltage SMT EMI/RF filter

June 29, 2012
p> At the IEEE MTT-S 2012 International Microwave Symposium (IMS2012) in Montreal, CTS Tusonix, (http://www.tusonix.com/), a Subsidiary of CTS Electronic Components, a global leader in the design and manufacture of electronic components, announced a new High Voltage EMI/RFI Filter for applications where Agency approvals are required. These filters are rated for 1500VAC/2121VDC test voltage.


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UltraSource Inc. releases new thin film microcircuit CopperVia

June 7, 2012

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.


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LTCC materials system from Ferro Electronic Materials helps reduce power use

April 3, 2012

Ferro Electronic Materials expands its low temperature co-fired ceramic (LTCC) portfolio, which includes industry-leading A6M and A6S,with a new line of cost-effective matched materials that offers better performance over a greater range of frequenciesand easier manufacturability than market alternatives. The company will introduce its new L8LTCC product line in booth 9-212 at SMT Hybrid Packaging 2012, to be held May 8-10 in Nuremberg, Germany.


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