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Articles Tagged with ''ceramic''

Remtec develops new, cost-effective gold tin plating technique

May 9, 2014

Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.

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Combined capacitor companies make debut

March 18, 2014

With a combined history exceeding 175 years, Dielectric Laboratories (DLI), Novacap, Syfer Technology and Voltronics have come together into a single organisation, Knowles Capacitors. This new entity is a division of Knowles Corp. of USA, an independent publicly traded company. A result of the merging of some of the world’s leading speciality capacitor manufacturers, Knowles Capacitors becomes one team of great people sharing a common vision.

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UltraSource Inc. featured in “Microwave and Millimeter-Wave Electronic Packaging”

March 13, 2014

Michael Casper, president & CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource Inc. is featured in the publication titled “Microwave and Millimeter-Wave Electronic Packaging” by Rick Sturdivant and published by Artech House.

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AVX extends capacitance & voltage ratings for C0G (NP0) MLCCs

December 20, 2013

AVX Corp., a leading manufacturer of advanced passive components and interconnect solutions, has expanded its range of high reliability C0G (NP0) dielectric multilayer ceramic capacitors (MLCCs). Available in case sizes spanning 01005 to 2225, voltages up to 500 V, and capacitance tolerances as low as ±0.1 pF, AVX’s C0G (NP0) MLCCs provide one of the most stable capacitor dielectrics available in today’s market, making them ideal for resonant circuit applications requiring superior stability or a precise temperature coefficient, such as: matching circuits, handheld devices, and GPS, among others.

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Video demonstrates Laser Services' custom ceramic alumina substrate processing capabilities

November 22, 2013

Laser Services Inc., an ISO and AS9100 registered laser job shop, has released a new video that focuses on their ceramic alumina substrate processing capabilities, specifically quick-turn laser cutting and drilling.

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Richardson RFPD introduces 48 V GaN-on-Si RF power transistors from Nitronex

November 20, 2013

Richardson RFPD Inc. announces that it is taking advance orders and offering full design support capabilities for a new family of 48 V gallium nitride-on-silicon (GaN-on-Si) RF power transistors from Nitronex.

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Remtec appoints William Dinardo new business development manager

November 19, 2013

Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper on Thick Film (PCTF®) metallization, has appointed William F. Dinardo to the new position of business development manager.

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Custom MMIC's new 6-20 GHz LNA delivers more than 20 dB of gain

November 13, 2013

Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits (MMICs), is introducing a new 6-20 GHz Low-Noise Amplifier to its growing product library, the CMD194C3. The new packaged broadband amplifier offers low noise figure and high gain while requiring a single-supply voltage.

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Compact 3/4W Chip Attenuator for Ku, K & Ka Bands

October 23, 2013

AV0904GA attenuatorBarry Industries, an ISO9001:2008 certified, ITAR registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging, introduces a new 0904 size chip attenuator for Ku, K and Ka Bands. The AV0904GA attenuator has been characterized to 30 GHz, features gold wirebondable I/O terminals with epoxy mount ground pads and is rated to 750 mW. Typical VSWR is 1.20:1 from DC to 18 GHz and 1.50:1 to 30 GHz.

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