Articles Tagged with ''high-speed''

 HYPERLABS Inc. has announced the release of two new high-speed triggerable impulse generators. 

 Richardson RFPD, Inc. announced  the availability and full design support capabilities for three new ultra-broadband capacitors from American Technical Ceramics Corp. (ATC). 

Agilent Technologies Inc. introduces an eight-channel version of its U5309A 8-bit single-slot PCIe®Gen2 digitizer with on-board processing, providing unprecedented channel density and minimum footprint at this level of performance.

Anritsu Co. introduces the VectorStar™ ME7838E vector network analyzer (VNA) broadband system that provides frequency coverage from 70 kHz to 110 GHz in a single connection. Incorporating all the benefits of the VectorStar ME7838 series broadband system, the ME7838E addresses the challenges associated with today's high-speed device characterization.

Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced that it has launched a new certification program for PCB fabricators. The program is open to qualifying fabricators in the United States able to demonstrate the ability to process such high-speed digital materials as Isola’s I-Tera MT and I-Speed.

Two downlink antennas that are the fastest of their kind to operate in space are being integrated into the protected communications payload built by Northrop Grumman Corp. for the fourth Advanced Extremely High Frequency (AEHF) satellite.

Agilent Technologies Inc. will show test and measurement solutions at the Optical Fiber Communication Conference & Exposition, March 11-13 in San Francisco, CA. Agilent is the only T&M vendor offering solutions along the entire value chain of the Web 2.0—from components through data centers to telecom, addressing the latest technologies such as silicon photonics and coherent, multi-carrier transmission.

Agilent Technologies Inc. announced it will show its newest wireless design and test solutions that address present and future test technology challenges in  LTE, LTE-A, and 3GPP, Releases 11 and 12, at Mobile World Congress, Feb. 24-27, Barcelona, Spain.

The Molex SpeedStack™ mezzanine connector system provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications.  Compact SpeedStack connectors feature a stack height of 4.00mm and support data rates up to 40 Gbps per differential pair.  SpeedStack connectors will be displayed at Molex booth 117, DesignCon 2014.

Anritsu Co. (DesignCon booth #501), a world leader in high-speed signal integrity test solutions, will present a series of technical and educational sessions during DesignCon to help engineers solve the measurement challenges associated with designing high-speed semiconductors, and communications systems and devices. Additionally, technical demonstrations will be held in the Anritsu booth throughout DesignCon, which is scheduled for January 28-31 in the Santa Clara Convention Center, Santa Clara, CA.