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Articles Tagged with ''high-speed''
Agilent Technologies Inc. announced it will show its newest wireless design and test solutions that address present and future test technology challenges in LTE, LTE-A, and 3GPP, Releases 11 and 12, at Mobile World Congress, Feb. 24-27, Barcelona, Spain.
The Molex SpeedStack™ mezzanine connector system provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications. Compact SpeedStack connectors feature a stack height of 4.00mm and support data rates up to 40 Gbps per differential pair. SpeedStack connectors will be displayed at Molex booth 117, DesignCon 2014.
Technical and educational sessions addressing high-speed signal integrity challenges to be conducted by Anritsu at DesignCon 2014
Anritsu Co. (DesignCon booth #501), a world leader in high-speed signal integrity test solutions, will present a series of technical and educational sessions during DesignCon to help engineers solve the measurement challenges associated with designing high-speed semiconductors, and communications systems and devices. Additionally, technical demonstrations will be held in the Anritsu booth throughout DesignCon, which is scheduled for January 28-31 in the Santa Clara Convention Center, Santa Clara, CA.
Anritsu Co. announces a working cooperation with Wild River Technology. The two companies are collaborating to provide test solutions that meet the rigorous test requirements associated with high-speed serial data interconnects, SERDES testing, cables, and backplanes used in NGNs.
Now with the CST Webinar Series 2013 all wrapped-up, the company would like to thank all those who tuned-in live and heard its experts explore topics across the electromagnetic (EM) spectrum.
Anritsu Co. introduces a 32 Gbit/s extension option for its MP1825B 4Tap Emphasis that features industry leading Tr/Tf speeds and low jitter for up to four taps, allowing it to create emphasis that matches every industry standard. The MP1825B with the new option can be configured with the Anritsu MP1800A BERT signal quality analyzer to accurately measure the performance of high-speed interconnects used in Next Generation Network (NGN) applications in a cost- and time-efficient manner.
L-3 and Lemko fly an ultra-light airborne 4G LTE SwarmNetwork for tactical air to ground broadband communications
L-3 and Lemko Corp. flew an ultra-light airborne 4G LTE SwarmNetwork for tactical air to ground broadband communications. The X5 aerial demonstration proved that the same high-speed data infrastructure available in fixed mounted or dismounted configurations on the ground can be further supported from the air. Lemko's solution surpasses traditional LTE coverage bubbles by the ODC SwarmNetwork providing an ad-hoc LTE network with roaming, hand-off and survivability between nodes.
Molex Inc. will present leading edge high-speed, high-density solutions at the 39th European Conference on Optical Communication (ECOC 2013) being held September 22-26 at the ICC London ExCEL, England. ECOC is the largest European optical communications event for the fiber optic industry.
Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer Printed Circuit Boards (PCBs), announced its new low loss, low skew, high-speed material, GigaSync™. This product has been engineered to eliminate skew issues in high-speed designs that use differential pairs to create a balanced transmission system able to carry differential (equal and opposite) signals across a printed circuit board.