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Agilent Technologies Inc. extended its leadership in 802.11ac WLAN test solutions with its latest measurement application release for X-Series signal analyzers.
Soitec (Euronext Paris), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, announced it has more than doubled production of bonded silicon-on-sapphire (BSOS) substrates to meet increased demand from its strategic partner, Peregrine Semiconductor Corp. (NASDAQ: PSMI). Peregrine Semiconductor, a fabless provider of high-performance radio frequency integrated circuits (RFICs), has increased peak-production capability of its latest-generation STeP5 UltraCMOS® technology-based RF switches to more than two million units a day, to support design wins in the Radio Frequency Front Ends (RFFEs) of today’s most advanced 4G smart phones, and other wirelesscommunication applications.
What: The new application note, “Concepts and Measurements of HSPA+ Evolution” explains what’s new in HSPA+, technical details and operations, new requirements for HSPA+ 3GPP Release 7 & 8, new design and test products for HSPA+, including manufacturing test.
MagnaChip Semiconductor Corp. ("MagnaChip Semiconductor"), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), today announced that MagnaChip has expanded production of Peregrine Semiconductor's STeP5 UltraCMOS® technology-based RFIC product line, including the most recent DuNE™ Digitally Tunable Capacitors (DTCs) for RF impedance tuning.
Agilent Technologies Inc. has announced its annual Wireless Symposium focused on design, conformance and manufacturing, which will tour the UK in January 2013.
Eyelit Inc. announced that TowerJazz has selected the Eyelit Semiconductor Edition MES suite to be used in the fab of its subsidiary TowerJazz Japan Ltd.
Coaxial Components Corp., also known as Coaxicom, announced the appointment of Chris Feys to the company’s quality assurance team.
Agilent Technologies Inc. will demonstrate its latest boundary scan analyzer, plus inline in-circuit and functional test systems at the IPC APEX EXPO, Feb. 19-21, at the San Diego Convention Center (Booth 2827) in San Diego, Calif.
Agilent Technologies Inc. introduced its new E6607C EXT wireless communications test set, featuring an integrated multiport adapter for cost-effective, high-volume wireless device manufacturing test. Optimized for testing multiple devices simultaneously, the EXT-C with integrated multiport adapter enables up to 3x gain in effective test throughput (vs. the EXT-B) for less than 1.3x the price.
RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency solutions, announced a new Gallium Arsenide (GaAs) sourcing strategy intended to increase manufacturing flexibility, expand gross margin, and support aggressive growth.
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