Michael Casper, president & CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource Inc. is featured in the publication titled “Microwave and Millimeter-Wave Electronic Packaging” by Rick Sturdivant and published by Artech House.
A new application note from AWR highlights the use of AWR’s Microwave Office® circuit design software to develop a Q- to E-Band doubler and a K- to E-Band quadrupler circuit (including a medium E-Band power amplifier) for millimeter-wave wireless systems. The design effort resulted in an increase in gain as well as output power, two critical criteria for E-Band systems.
OMMIC announced the release of a new 200 GHz Fmax 30 V, 100 nm GaN/Si microwave and millimiter-wave MMIC process for application up to 100 GHz. This process is, for the time being, only open on a collaborative basis. Multi Chip Projects runs will soon be announced and the PDK will be available by the end of June 2013.
FUJITSU TEN Ltd. has developed "automotive compact 77GHz three-dimensional electronic scan millimeter-wave radar" that is capable of detecting an object in three dimensions, including "elevation" range in addition to distance and azimuth range. While making further improvements, FUJITSU TEN will aim at delivering this product to automobile manufacturers from 2014.
Agilent Technologies Inc. announced that its EXA signal analyzer is now the industry's most cost-effective millimeter-wave signal analyzer, covering frequencies up to 44 GHz. With external mixing, it can cover up to 325 GHz. The result is easier, more accurate millimeter-wave measurements.
Sub10 Systems has appointed SideBand Systems Inc. as its first North American distributor and value-added reseller. The company will resell all Sub10 Systems’ point-to-point radio link products in the U.S. market.