Articles Tagged with ''copper''

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Copper Mountain Technologies has introduced the virtual vector reflectometer PLANAR R54, operating in the frequency range of 85 MHz to 5.4 GHz.

Rogers Corp. will be displaying three of its leading high-performance circuit materials for mobile and fixed-site antennas at the upcoming Mobile Antenna Systems 2012 conference and exhibition. This key event for designers and specifiers of antennas for a wide range of fixed and mobile applications is scheduled for September 18-19, 2012 at the Hyatt Denver Tech Center (Denver, CO).

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials, will exhibit at the upcoming DesignCon 2013 conference and exhibition, January 29-30, 2013 at the Santa Clara Convention Center in Santa Clara, California. DesignCon is one of the Printed Circuit Board (PCB) industry’s premier events to learn about the latest advanced products, technologies and developments in the market.

EAM's low loss cable assemblies provide the highest level of electrical performance for applications requiring extremely low attenuation over a broad frequency range. By combining silver-plated copper center conductor, expanded PTFE tape dielectric, aluminum polyester or polymide tape, silver-plated copper outer braid, and FEP jacket, these low loss cable assemblies achieve outstanding electrical characteristics to 18 GHz.

Ohmega Technologies has introduced OhmegaPly® MTR™ Technology, which allows thin film resistors to be built within a printed circuit trace that is less than 100 microns (0.004”) wide. Using standard subtractive printed circuit board processes, it is ideal for high density interconnect (HDI) designs where passive component placement is difficult or impossible.

Molex Inc. introduces high density iPass+™ zHD vertical connectors for midplane or other non-edge-board applications. The new iPass+ zHD vertical connector system provides a 0.75vmm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidths.

Rache Corp. has developed a proprietary laser cutting process that can cut virtually all thin, ferrous metal and non-ferrous metal foils that range between .0005” to .060” thickness (.005 to .040 inches for aluminum, brass, and copper).