AWR Corp., the innovation leader in high-frequency EDA software, announced the sponsorship of two major student design competitions in China as part of the company’s continuing focus on working with universities worldwide to empower students with RF/microwave software tool experience and jumpstart their engineering careers.
What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.
Analog Devices Inc. (ADI) announced the release of a new version of its popular ADIsimRF™ design tool. The free design tool is the software accompaniment to ADI's complete portfolio of RF-to-digital functional blocks, allowing engineers to model RF signal chains using devices from across ADI's RF IC and data converter portfolio.
Aeroflex/Inmet Inc. and Modelithics Inc. have teamed to develop Global™ Models for Aeroflex/ Inmet surface mount attenuators (PCAF and PCAAF series) and high power chip resistors (NPC50-50W and NPC50-100W series). The advanced model features include substrate scaling, pad geometry scaling and part value selectability.
AWR has just published a new Microwave Office® software application note titled, “End-to-end Design and Realization of an X-band Transmission Analyzer Using AWR Circuit, System, and EM Software.” The note examines the complete flow and details the design of several critical design elements for this device, which integrates many RF components on a single printed circuit board (PCB).
A new white paper from AWR, “Understanding and Correctly Predicting Critical Metrics for Wireless RF Links,” highlights the advantages of using Visual System Simulator™ (VSS) RF system simulation software for detailed insight into the full performance of an RF link in next-generation wireless products.
EDI CON 2013 (March 12-14, Beijing, China) has announced a special workshop focusing on connectivity challenges and innovations for high-frequency systems and instrumentation equipment to be held on March 14th at the Beijing International Convention Center.
EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design organized by Microwave Journal and Horizon House has announced its line-up of speakers for the opening plenary session to be held on March 12th at the Beijing International Convention Center.