Ted Rappaport, founding director of NYU WIRELESS and a leading proponent of using the millimeter wave spectrum for wireless communications, discusses the FCC's recent rulemaking actions and technology developments that are paving the way to 5G.
Optenni Ltd. announces a new version of the Optenni Lab matching circuit optimization and antenna analysis software featuring a unique easy-to-use simultaneous multiport matching capability for antennas and other RF applications.
Mini-Circuits and Modelithics Inc. have agreed to collaborate in the development of high-accuracy EDA simulation models of Mini-Circuits’ surface-mount microwave precision fixed attenuators YAT and RCAT series.
Analog Devices Inc., in collaboration with Xilinx® Inc. and MathWorks Inc., is launching a series of design conferences for analog, mixed-signal and embedded systems engineers. Based on the theme “Discuss. Design. Deliver.,” the conferences will bring together experts in high-performance analog, field-programmable gate arrays (FPGA) and modeling tools to present complete signal chain and system-ready solutions for complex design challenges.
Molex Inc. announced its Projected Capacitive Touch Screens, which leverage existing Molex capacitive switch technology to deliver multi-touch functionality that is responsive and intuitive to operate. The touch screens allow Original Equipment Manufacturers (OEMs) to meet specific customer needs by providing customized embedded software; multiple screen and glass styles; a variety of treatment finishes and various output interface choices.
Michael Casper, president and CEO of UltraSource Inc., a thin film microchip manufacturer, is pleased to announce the update of an application note on the company's website titled: “How Your CAD File Affects the Success of Your New Thin Film Design.”
Auriga Microwave, an innovator in the design of high-powered RF and microwave devices, announces that the U.S. Patent and Trademark Office granted a patent for technology that will make the control circuit design much simpler for high-power RF switches used in many communication systems.
EDI CON 2013 - High-frequency electronic design engineers converged for learning and networking opportunities in Beijing. The event drew in excess of 2,000 attendees including over 1,100 unique conference delegates, over 800 visitors and exhibitors and more than 30 members of the press.
LPKF Laser & Electronics has announced it will exhibit at the 2013 Design West Exposition, which takes place April 23-25 at the McEnery Convention Center in San Jose, CA. From booth 1646, LPKF will demonstrate its line of in-house rapid PCB prototyping equipment by creating boards on its top of the line PCB milling machine, the ProtoMat S103.
AWR Corp. announces the addition of two new stories to its roster of university student and professor design successes using AWR software. These new stories include contributions from Okinawa National College of Technology in Japan and Macquarie University in Australia.
Richardson RFPD Inc. announces its attendance and participation at EDI CON 2013. EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets.