Agilent Technologies Inc. announced that it donated bench-top electronic measurement equipment worth $300,000 to the Texas Instruments Electronics Design Laboratory, which opened at the University of California, Berkeley. The new lab will provide more than 1,000 Berkeley students each year with hands-on experience applying the principles they learn in gateway electrical engineering courses such as microelectronic circuit design.
RFMW Ltd. announces design and sales support for TriQuint Semiconductor’sTGF2025 high efficiency heterojunction power FET. This discrete device utilizes TriQuint’s proven standard 0.25um power pHEMT production process featuring advanced techniques to optimize microwave power and efficiency at high drain bias operating conditions.
Weinschel Associates, a leading manufacturer of broadband RF and microwave products, announced the launch of its redesigned, state-of-the-art website. The launch is the culmination of months of market research, design and engineering. Weinschel Associates has taken a customer-centric approach to the redesign process, determining core features based on market demand and the results of formal usability studies.
In a major technology development for the mobile industry, Ooredoo has collaborated with CommScope to develop a new approach to building wireless networks, which will improve installation quality and on-going network performance and reduce deployment times, in an alliance that could have major benefits for operators around the world.
Optenni Ltd. announces a new version of the Optenni Lab matching circuit optimization and antenna analysis software featuring a unique easy-to-use simultaneous multiport matching capability for antennas and other RF applications.
Mini-Circuits and Modelithics Inc. have agreed to collaborate in the development of high-accuracy EDA simulation models of Mini-Circuits’ surface-mount microwave precision fixed attenuators YAT and RCAT series.
Analog Devices Inc., in collaboration with Xilinx® Inc. and MathWorks Inc., is launching a series of design conferences for analog, mixed-signal and embedded systems engineers. Based on the theme “Discuss. Design. Deliver.,” the conferences will bring together experts in high-performance analog, field-programmable gate arrays (FPGA) and modeling tools to present complete signal chain and system-ready solutions for complex design challenges.
Molex Inc. announced its Projected Capacitive Touch Screens, which leverage existing Molex capacitive switch technology to deliver multi-touch functionality that is responsive and intuitive to operate. The touch screens allow Original Equipment Manufacturers (OEMs) to meet specific customer needs by providing customized embedded software; multiple screen and glass styles; a variety of treatment finishes and various output interface choices.
Michael Casper, president and CEO of UltraSource Inc., a thin film microchip manufacturer, is pleased to announce the update of an application note on the company's website titled: “How Your CAD File Affects the Success of Your New Thin Film Design.”