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Articles Tagged with ''design''

University students achieve design success with AWR Microwave Office

EDAFocus

AWR announces the release of two new university success stories that reveal how students use AWR software to design novel and award-winning microwave/RF products.


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AWR’s schedule of activities at MWE 2012

What: AWR is offering an array of software demonstrations, lectures, and partner presentations at the Microwave Workshops and Exhibition 2012 (MWE2012) in Yokohama, Japan from November 28 through November 30.


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RFS debuts 6 GHz Category A SB6-W60B antennas with high-speed wind stability

Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announced that it has introduced a new addition to the CompactLine®  series of microwave antennas with the release of the 6 GHz Category A SB6-W60B. Featuring a wind-tunnel tested design suited for both tight urban locations and rugged outposts, the SB6-W60B offers a superior radiation pattern for consistent performance with less interference.  


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eesy-ic opens new design center in Germany

eesy-ic has opened a new design center in Nuremberg, Germany. The company specializes in customized integrated circuit (ICs) development as well as application specific ICs with analog focus.


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Agilent ships newest GoldenGate software release for RFIC designers

Agilent Technologies Inc. announced shipment of its GoldenGate 2012.10 RFIC simulation, verification and analysis software.


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Agilent application note: Concepts and measurements of HSPA+ evolution

What: The new application note, “Concepts and Measurements of HSPA+ Evolution” explains what’s new in HSPA+, technical details and operations, new requirements for HSPA+ 3GPP Release 7 & 8, new design and test products for HSPA+, including  manufacturing test.


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Electronica launch for IQD’s new industrial temperature range SMD OCXO

IQD has extended the performance of their IQOV-90 series high stability low phase noise OCXOs to encompass the full standard industrial temperature range of -40 to 85°C. High operating temperature ranges are significantly more technically challenging in OCXOs than for other frequency products. By increasing the internal crystals turnover point to a safe margin above 85°C and reducing the thermal loss of the circuit, our design team have been able to increase the maximum external temperature range of the part to 85°C.


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DesignCon 2013 announces conference program and keynote speakers

Recognized throughout the semiconductor and electronic design industries as the premiere annual trade event, DesignCon 2013 is scheduled for January 28-31 in Santa Clara, Calif.  Hosted by UBM Electronics, the daily source of essential business and technical information for the electronics industry’s decision makers, the 14-track technical DesignCon conference program will include more than 100 in-depth tutorials, technical paper sessions and panel discussions.


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Expanded product offering and custom capabilities from API Technologies' Magnetics group

API Technologies Corp., a trusted provider of RF/microwave, microelectronics, and security solutions for critical and high-reliability applications, announces an expanded magnetic product family and increased custom design and manufacturing capabilities. Since acquiring three well known magnetic entities, API has combined the people, products and technologies into a single division. The API Magnetics group now produces a broader range of magnetic devices, including transformers, inductors, chokes and coils as well as custom application-specific solutions.


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Micrel offers highest level of clock tree integration with revolutionary ClockWorks Fusion

Micrel Inc., an industry leader in high-performance linear and power solutions, LAN, and timing and communications solutions, announces ClockWorks Fusion, a revolutionary clock generation product family that integrates the crystal, frequency synthesizer and fan-out buffer to deliver the industry’s highest level of integration. The MX85 is the first in a series of devices aimed at simultaneously meeting the ultra-low jitter (less than 200fs) and integration requirements of 10/40/100 Gigabit Ethernet, PCIe 2.0/3.0, Fibre Channel, SAS/SATA, and high speed reference clocking for FPGA and SerDesapplications.


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