EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design organized by Microwave Journal and Horizon House has announced its line-up of speakers for the opening plenary session to be held on March 12th at the Beijing International Convention Center.
AR RF/Microwave Instrumentation has announced the addition of Joseph DiBiase to its staff of application engineers. DiBiase will assist AR customers and provide support to various AR engineering groups.
Agilent Technologies Inc. will demonstrate its latest boundary scan analyzer, plus inline in-circuit and functional test systems at the IPC APEX EXPO, Feb. 19-21, at the San Diego Convention Center (Booth 2827) in San Diego, Calif.
Photo Stencil LLC, a leading full-service provider of high-performance stencils and tooling, will present the papers, Printing and Assembly Challenges for QFN Devices and Two Print Stencils Process at IPC APEX 2013. Videos of the presenters describing these papers can be found at www.photostencil.com/apex2013.php.
Molex Inc. introduces high density iPass+™ zHD vertical connectors for midplane or other non-edge-board applications. The new iPass+ zHD vertical connector system provides a 0.75vmm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidths.
UBM Tech, whose portfolio includes essential business and technical information for design engineers and the electronics industry, announced the 2013 DesignVision Award winners, including industry firms Mentor Graphics, TE Connectivity, ANSYS Inc., Upverter, MicroSemi, Teledyne LeCroy and Averna.
AWR Corp.and Zuken announce AWR Connected for Zuken™. This RF printed circuit board (PCB) verification flow simplifies the PCB design process and therefore shortens design cycles by enabling users to quickly and easily simulate and verify embedded RF functionality.