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Articles Tagged with ''design''
Richardson RFPD Inc. announces its attendance and participation at the 2012 IEEE International Microwave Symposium (IMS). IMS, along with the RFIC symposium and the ARFTG conference, is part of Microwave Week, the largest gathering of radio frequency (RF) and microwave professionals, and the most important forum for the latest and most advanced research in these fields.
Cadence Design Systems, Inc. and Samsung Electronics have collaborated to deliver a 20 nanometer design methodology that incorporates double patterning technology for joint customer deployment and internal test chips. The collaboration brings new process advances for mobile consumer electronics, enabling design at 20 nm and future process nodes.
Agilent Technologies Inc. announced a new release of SystemVue, Agilent’s premier platform for designing communications systems.
Agilent Technologies Inc. announced the latest release of its RFIC simulation, verification and analysis software, GoldenGate 2012.
Visit AWR at the Booth #1514 to see Analyst™ - 3D EM technology for bumps, bond wires, tapered vias and more - and the latest release of Microwave Office™, Visual System Simulator™, AXIEM® and Analog Office® for MMIC, RFIC, RF PCB and module design.
AWR Corp. announces that it has added Taiwan to the list of cities scheduled for the July 2012 tour of the AWR Design Forum (ADF) 2012. The Taiwan event will take place on Thursday, July 12.
RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced that company executives are scheduled to present at the 2012 Stephens Inc. Spring Investment Conference in New York, NY on Wednesday, June 6, 2012, at 9:00 a.m. Eastern Time.
MAGUS Ltd, EMSS Ltd., and CST AG, announced the version 4.0 release of Antenna Magus. It has crossed the 200 antenna mark, giving rise to the claims that it is the world’s leading antenna design tool.
Horizon House has announced plans to launch the inaugural Electronic Design Innovation Conference (EDI CON 2013) in Beijing, China in March 2013 that will focus on design concepts and techniques of RF, microwave and high-speed digital components and systems in China