Articles Tagged with ''design''

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Computer Simulation Technology (CST) launches a new product that analyzes PCBs with respect to EMC and SI related design rules. Design engineers dealing with electromagnetic compatibility (EMC) and signal integrity (SI) of PCBs, can now employ CST BOARDCHECK™ to get a quick overview of potential problems in their layout. CST BOARDCHECK supports a multitude of popular layout formats such as CADENCE® ALLEGRO®, Zuken CR 5000, Mentor Graphics® Expedition® and ODB++, which are read-in using the sophisticated CST STUDIO SUITE® import filters.

Computer Simulation Technology (CST) will be previewing CST STUDIO SUITE 2013 and its new design environment at EuMW 2012, booth #217. The increasingly complex tasks design engineers face today require a large number of sometimes specialised features. Simulation software vendors such as CST have enhanced their tools to accommodate these requirements.

UBM Tech, whose portfolio includes essential business and technical information for design engineers and the electronics industry, announced the 2013 DesignVision Award winners, including industry firms Mentor Graphics, TE Connectivity, ANSYS Inc., Upverter, MicroSemi, Teledyne LeCroy and Averna.

Molex Inc. introduces high density iPass+™ zHD vertical connectors for midplane or other non-edge-board applications. The new iPass+ zHD vertical connector system provides a 0.75vmm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidths.

Photo Stencil LLC, a leading full-service provider of high-performance stencils and tooling, will present the papers, Printing and Assembly Challenges for QFN Devices and Two Print Stencils Process at IPC APEX 2013. Videos of the presenters describing these papers can be found at www.photostencil.com/apex2013.php.

Mentor Graphics announced the new release of its HyperLynx® product featuring advanced 3D channel and trace modeling, improved DDR signoff verification, and accelerated simulation performance.

Agilent Technologies Inc. will demonstrate its latest boundary scan analyzer, plus inline in-circuit and functional test systems at the IPC APEX EXPO, Feb. 19-21, at the San Diego Convention Center (Booth 2827) in San Diego, Calif.

Agilent Technologies Inc. announced the largest in-kind software donation ever in its longstanding relationship with the Georgia Institute of Technology.

AR RF/Microwave Instrumentation has announced the addition of Joseph DiBiase to its staff of application engineers. DiBiase will assist AR customers and provide support to various AR engineering groups.

EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design organized by Microwave Journal and Horizon House has announced its line-up of speakers for the opening plenary session to be held on March 12th at the Beijing International Convention Center.