- Buyers Guide
At electronica 2012 in Munich, Germany CTS Corp., a global leader in ceramic, quartz and piezo technologies announces they will be showcasing their latest technology. CTS’ booth is co-located with its local representatives, MRC Components and Electrade GmbH in Hall B5 Booth 337.
The Samsung Galaxy Appeal is one of the first mass produced phones to ship with a high performance 3G CMOS power amplifier (PA). Despite an historical presence from CMOSin the 2G handset market concerns over performance have severely limited its progress in the 3G domain.
Mesa Microwave Corp. introduces P/N MMCNPPA plug to plug adapter in stainless finish at 50 ohms.
AWR Corp., the innovation leader in high-frequency EDA software, today announces RFP™, an innovative new frequency planning wizard within Visual System Simulator™ (VSS) that enables engineers to effortlessly and efficiently determine spurious free bandwidths when designing complex radio communications systems.
MITEQ has announced that the company’s president, Howard Hausman will deliver a 40 minute workshop at EDI CON 2013 titled, “Applications of Fiber Optic Links in RF and Microwave Systems” to the audience of RF, microwave and high speed digital designers attending this premier event in Beijing, China.
Quality is making a comeback as world markets recognize the superiority of US-manufactured RF connectors and cable assemblies. Nowhere is this more evident than at Coaxicom, a Florida-based manufacturer and supplier of high-quality RF microwave products, who continues to gain market share in its 28th year of business. Following an industry epidemic of counterfeit products being shipped from overseas sources, engineers have expanded their focus from pure price consideration to assuring delivery from reputable resources.
UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that the company now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding.
AWR has just published a new Microwave Office® software application note titled, “End-to-end Design and Realization of an X-band Transmission Analyzer Using AWR Circuit, System, and EM Software.” The note examines the complete flow and details the design of several critical design elements for this device, which integrates many RF components on a single printed circuit board (PCB).
RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency solutions, announced the company will present its expanding portfolio of industry-leading radio frequency (RF) components for smartphones, tablets and other data-centric mobile devices at the 2013 Mobile World Congress (MWC 2013).
Get access to premium content and e-newsletters by registering on the web site. You can also subscribe to Microwave Journal magazine.