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Articles Tagged with ''packaging''

TJ Green Associates to offer a microwave packaging technology course in Boston

April 4, 2014

TJ Green Associates LLC announced it will be offering a three day microwave packaging technology course in Boston, May 7-9th.

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IKE Micro completes in-house air cavity array packaging capability

March 18, 2014

IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies. 

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UltraSource Inc. featured in “Microwave and Millimeter-Wave Electronic Packaging”

March 13, 2014

Michael Casper, president & CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource Inc. is featured in the publication titled “Microwave and Millimeter-Wave Electronic Packaging” by Rick Sturdivant and published by Artech House.

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Indium Corp. technology expert to present at EPTC

November 25, 2013

Indium Corp.'s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore. 

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Remtec appoints William Dinardo new business development manager

November 19, 2013

Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper on Thick Film (PCTF®) metallization, has appointed William F. Dinardo to the new position of business development manager.

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Indium Corp. wins global technology award

November 15, 2013

Indium Corp. was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12. 

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Indium Corp.'s technology experts to present at SMTA/iNEMI

November 6, 2013

Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, and Dr. Ron Lasky, senior technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, CA.

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Nujira selects ASE as packaging and test partner for handset ET chip

September 9, 2013

Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.

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MIL-STD is standard in KCB booth at IMS 2013

June 3, 2013

KCB Solutions is pleased to announce a suite of MIL-STD certified products and services for the military, aerospace, and defense market. They’ll be exhibiting in booth #1610 at the International Microwave Symposium in Seattle, WA June 4-6th. Senior staff will be on-hand to answer questions about KCB’s leading edge semiconductor packaging services, manufacturing services and recently launched standardized and fully-screened components.

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