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Articles Tagged with ''packaging''

RJR Polymers changes name to RJR Technologies

RJR Polymers, a leading developer of high performance liquid crystal polymer (LCP) Air Cavity semiconductor packaging (ACP), announced that it has changed its name to RJR Technologies Inc. The new name reflects the company’s growing role as a leading developer and high volume manufacturer of high performance LCP Air Cavity plastic packaging for RF and microwave applications. The company will begin operating under its new name and form a new website, www.rjrtechnologies.com, immediately.


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Registration opens for inaugural Boards, Chips and Packaging IMPACT conference

Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs) and Semico Research, a semiconductor marketing and consulting research company, announced that they have teamed up to launch Boards, Chips and Packaging: Designing to Maximize Results. This new industry event will span the system-level ecosystem to address the roles of system architecture, board design, chip design, package design and final fabrication and assembly processes for hardware product development.


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