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Articles Tagged with ''packaging''
TJ Green Associates LLC announced it will be offering a three day microwave packaging technology course in Boston, May 7-9th.
IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies.
Michael Casper, president & CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource Inc. is featured in the publication titled “Microwave and Millimeter-Wave Electronic Packaging” by Rick Sturdivant and published by Artech House.
Indium Corp.'s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.
Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper on Thick Film (PCTF®) metallization, has appointed William F. Dinardo to the new position of business development manager.
Indium Corp. was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.
Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, and Dr. Ron Lasky, senior technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, CA.
Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.
KCB Solutions is pleased to announce a suite of MIL-STD certified products and services for the military, aerospace, and defense market. They’ll be exhibiting in booth #1610 at the International Microwave Symposium in Seattle, WA June 4-6th. Senior staff will be on-hand to answer questions about KCB’s leading edge semiconductor packaging services, manufacturing services and recently launched standardized and fully-screened components.