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Articles Tagged with ''packaging''

TJ Green Associates to offer a microwave packaging technology course in Boston

TJ Green Associates LLC
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TJ Green Associates LLC announced it will be offering a three day microwave packaging technology course in Boston, May 7-9th.


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IKE Micro completes in-house air cavity array packaging capability

IKE Micro/Bonding Source
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IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies. 


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UltraSource Inc. featured in “Microwave and Millimeter-Wave Electronic Packaging”

UltraSource Inc.
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Michael Casper, president & CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource Inc. is featured in the publication titled “Microwave and Millimeter-Wave Electronic Packaging” by Rick Sturdivant and published by Artech House.


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The Future of mm-wave Packaging

Liam Devlin, Plextek RF Integration, Great Chesterford, UK
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Indium Corp. technology expert to present at EPTC

Indium Corp.
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Indium Corp.'s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore. 


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Remtec appoints William Dinardo new business development manager

Remtec Inc.
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Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper on Thick Film (PCTF®) metallization, has appointed William F. Dinardo to the new position of business development manager.


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Indium Corp. wins global technology award

Indium Corp.
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Indium Corp. was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12. 


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Indium Corp.'s technology experts to present at SMTA/iNEMI

Indium Corp.
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Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, and Dr. Ron Lasky, senior technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, CA.


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Nujira selects ASE as packaging and test partner for handset ET chip

RFIC
Nujira
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Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.


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MIL-STD is standard in KCB booth at IMS 2013

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KCB Solutions is pleased to announce a suite of MIL-STD certified products and services for the military, aerospace, and defense market. They’ll be exhibiting in booth #1610 at the International Microwave Symposium in Seattle, WA June 4-6th. Senior staff will be on-hand to answer questions about KCB’s leading edge semiconductor packaging services, manufacturing services and recently launched standardized and fully-screened components.


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