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Articles Tagged with ''packaging''

TJ Green Associates to offer one-day LTCC packaging technology course

 TJ Green Associates will be offering a one-day LTCC Packaging Technology course at the NATEL Ceramic Plant in Carlsbad, Calif. on October 9, 2014. 


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TJ Green Associates to offer a microwave packaging technology course in Boston

TJ Green Associates LLC announced it will be offering a three day microwave packaging technology course in Boston, May 7-9th.


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IKE Micro completes in-house air cavity array packaging capability

IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies. 


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UltraSource Inc. featured in “Microwave and Millimeter-Wave Electronic Packaging”

Michael Casper, president & CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource Inc. is featured in the publication titled “Microwave and Millimeter-Wave Electronic Packaging” by Rick Sturdivant and published by Artech House.


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The Future of mm-wave Packaging

Indium Corp. technology expert to present at EPTC

Indium Corp.'s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore. 


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Remtec appoints William Dinardo new business development manager

Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper on Thick Film (PCTF®) metallization, has appointed William F. Dinardo to the new position of business development manager.


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Indium Corp. wins global technology award

Indium Corp. was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12. 


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Indium Corp.'s technology experts to present at SMTA/iNEMI

Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, and Dr. Ron Lasky, senior technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, CA.


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Nujira selects ASE as packaging and test partner for handset ET chip

RFIC

Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.


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