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Articles Tagged with ''agreement''

Aeris hires Michelle Avary as VP, planning and business development for automotive

April 16, 2014

Aeris Communications, the Made for Machines™ technology and service provider, announced the addition of Michelle Avary as the vice president, business development-automotive. Avary brings more than 15 years of experience to the role, serving most recently as the Director, Technology Strategy for Harman International. Previously, she worked for Toyota for more than a decade where she led and developed strategies for its telematics products and services.

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RFMW Ltd. announces Aviacomm distribution agreement

April 14, 2014

RFMW Ltd. and Aviacomm Inc. announced a distribution agreement effective April 1, 2014. The agreement initially covers customers in North America, Europe and South East Asia with the possibility of future expansion. Aviacomm is a leader in wideband RF CMOS ICs. RFMW Ltd. is a specialized distributor providing customers and suppliers with focused distribution of RF and microwave components as well as specialized component-engineering support.

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Rockwell Collins to provide Inmarsat’s GX Aviation Ka-Band service to airlines

April 8, 2014

Inmarsat, the leading provider of global mobile satellite communications services and Rockwell Collins, a pioneer in communications, aviation electronics and information management, have signed a Memorandum of Understanding to make Rockwell Collins a Value Added Reseller (VAR) of GX Aviation Ka-broadband service.  

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MACOM announces IP licensing program for GaN-on-Si technology

March 31, 2014

MACOM announced an IP licensing program for Gallium Nitride (GaN) on silicon technology.  MACOM detailed recent progress in two areas critical to realizing its future vision of enabling the mainstream adoption of GaN as a large-scale RF semiconductor technology across the industry.

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Hittite Microwave to purchase the assets of Keragis

March 19, 2014

Hittite Microwave Corp. announced that it has entered into a definitive agreement to buy substantially all the assets of the Keragis Corp., a provider of extremely high power, wideband amplifier modules, located in San Diego, CA. The purchase price was not disclosed.

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National Instruments announces licensing agreement with Broadcom

February 4, 2014

National Instruments announced that it is the first vendor to execute a Manufacturing Test License (MTL) agreement with Broadcom Corp. The MTL agreement authorizes NI to provide manufacturing test solutions and modifiable application source code to Broadcom® wireless LAN and Bluetooth device customers.

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Mindspeed to sell assets of its wireless infrastructure unit to Intel

December 30, 2013

Mindspeed Technologies Inc., a leading supplier of semiconductor solutions for network infrastructure, announced that it has signed a definitive agreement to sell the assets of its wireless infrastructure business unit to Intel Corp. The asset sale was contemplated by the agreement and plan of merger with M/A-COM Technology Solutions Holdings Inc., announced on November 5, 2013.

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MACOM successfully completes tender offer for Mindspeed Technologies

December 19, 2013

M/A-COM Technology Solutions Holdings Inc. (MACOM), a leading supplier of high performance RF, microwave, and millimeter wave products, announced that it has successfully completed its previously announced tender offer to purchase all outstanding shares of common stock of Mindspeed Technologies Inc. (Mindspeed) for $5.05 per share in cash.

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SAAB and DragonWave upgrade Sweden's national security communication network

December 12, 2013

DragonWave Inc., a leading global supplier of packet microwave radio systems for mobile and access networks, announced an agreement with defense and security company Saab to work collaboratively on the expansion and enhancement of national security communication networks in Sweden, Norway, Finland, Denmark and Iceland.

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CEA-Leti signs agreement with Qualcomm to assess sequential 3D technology

December 9, 2013

CEA-Leti announced an agreement with Qualcomm Technologies Inc., a subsidiary of Qualcomm Inc., to assess the feasibility and the value of Leti’s sequential 3D technology.

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