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Articles Tagged with ''ieee''
Intel Corporations’ Intel Labs Vice President and Director of Integrated Computing Research (ICR) Dr. Vida Ilderem will serve as plenary session speaker on Monday, June 2, 2014 at the IEEE MTT-S 2014 International Microwave Symposium (IMS), marking the first female plenary speaker in the history of IMS.
The IEEE IFCS Standing Committee announced that Dr. Ulrich L. Rohde has been selected for the 2014 IFCS C.B. Sawyer Award to be presented at the 2014 IEEE International Frequency Control Symposium.
Computer Simulation Technology (CST), Darmstadt, announces winners of the CST University Publication Award 2013, an annual grant to university institutes and researchers for published papers related to 3D electromagnetic field simulation applications.
Indium Corp.'s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.
Linear Technology Corp. introduces the LT4321, an ideal diode bridge controller that replaces two diode bridge rectifiers with low-loss N-channel MOSFET bridges to increase the available power and reduce heat dissipation in a Power over Ethernet Powered Device (PoE PD). IEEE 802.3 PoE specifications require PDs to accept DC supply voltages of any polarity over their Ethernet inputs.
Richardson RFPD Inc. announces its attendance and participation at the 2013 International IEEE COMCAS. The annual conference provides a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwaves, communications, antennas, solid state circuits, electromagnetic compatibility, electron devices, radar and electronic systems engineering.
ThinkRF announced that five of its employees have been recognized for their participation in this year’s IEEE AUTOTESTCON. AUTOTESTCON is the world’s premier conference that brings together the military/aerospace automatic test industry and government/military acquirers and users to share new technologies, discuss innovative applications, and exhibit products and services.
Mini-Circuits is pleased to contribute to the 2013 IEEE Conference on Microwaves, Communications, Antennas, and Electronic Systems(COMCAS) as a platinum sponsor. Representatives from Mini-Circuits and MCDI, Mini-Circuits’ new distributor in Israel, will be exhibiting at Booth 31 with a showcase of its rapidly growing line of portable test equipment and other selected new products.
TMD has announced it will be exhibiting for the first time at the IEEE International Symposium on Electromagnetic Compatibility, which will take place in August in Denver, Colorado.