Auriga Microwave and Focus Microwaves, RF microwave industry market leaders, integrated their showcase systems, Auriga's AU4850 Pulsed IV/RF Characterization System and Focus' Harmonic Load-pull System to provide users unmatched measurement capabilities. Responding to market demands, Auriga and Focus have developed a software bridge to provide users harmonic pulsed load-pull measurement capability. The software will be offered by both companies through their respective sales channels.
API Technologies Corp., a trusted provider of RF/microwave, microelectronics, and security solutions for critical and high-reliability applications, announced that it will showcase a wide range of RF, microwave, and millimeter wave products at Booth #744 during the 2013 IEEE International Microwave Symposium (IMS2013). The IMS 2013 Exhibition takes place June 4-6 at the Washington State Convention Center in Seattle.
To simplify the development of ZigBee® wireless connectivity-enabled smart energy infrastructure, home and building automation and intelligent lighting gateways, Texas Instruments Inc. (TI) announced the availability of the CC2538 system-on-chip (SoC). The industry’s most integrated ZigBee solution, the CC2538 is cost-efficient with an ARM® Cortex™-M3 MCU, memory and hardware accelerators on one piece of silicon.
The market for chipsets containing LTE baseband processors has ramped up quickly, and is fraught with competition. 15 companies offer over 35 chipsets with LTE, from singlemode LTE chipsets to multimode chipsets integrated with application processors and wireless connectivity. ABI Research’s latest Competitive Assessment ranked Qualcomm first in LTE baseband product features and other attributes, followed by ST-Ericsson and Sequans.
Hittite Microwave Corp., a of complete MMIC based solutions for communication & military markets, has introduced the HMC1023LP5E, a new addition to its IF/Baseband Processing integrated circuit product line.
Mobile device design is increasingly reliant on integrated platforms, which are chipsets based on combinations of application processor, baseband processor, and wireless connectivity technologies. In 2012, 19 percent of handsets shipped were based on an integrated platform; set to more than double to 46 percent in 2018.