The market for chipsets containing LTE baseband processors has ramped up quickly, and is fraught with competition. 15 companies offer over 35 chipsets with LTE, from singlemode LTE chipsets to multimode chipsets integrated with application processors and wireless connectivity. ABI Research’s latest Competitive Assessment ranked Qualcomm first in LTE baseband product features and other attributes, followed by ST-Ericsson and Sequans.
Hittite Microwave Corp., a of complete MMIC based solutions for communication & military markets, has introduced the HMC1023LP5E, a new addition to its IF/Baseband Processing integrated circuit product line.
Mobile device design is increasingly reliant on integrated platforms, which are chipsets based on combinations of application processor, baseband processor, and wireless connectivity technologies. In 2012, 19 percent of handsets shipped were based on an integrated platform; set to more than double to 46 percent in 2018.
Maxim Integrated Products Inc. announced the MAX2173 RF to Bits tuner for digital audio broadcast (DAB) applications in automobiles and other mobile DAB/FM products. The industry’s first RF to Bits DAB/FM tuner integrates a radio tuner, analog-to-digital converter (ADC), and digital filtering, and uses a digital I2S output to interface directly to digital signal processors (DSPs).
TriQuint Semiconductor Inc. has released three new packaged GaAs RF power amplifiers that deliver high output, gain and efficiency for commercial and defense applications including point-to-point microwave radio, radar, VSAT and related applications.
Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new laterally diffused metal oxide semiconductor (LDMOS) transistor targeting land mobile radio from Freescale Semiconductor Inc.
Skyworks Solutions Inc. expanded its wireless portfolio with the introduction of highly integrated front-end modules enabling 802.11ac connectivity in smartphones and tablets. The company’s precision analog semiconductors are already being utilized in many of the world’s first commercially-available 802.11ac notebooks, ultrabooks, LED TVs, routers, USB data cards and Blu-Ray® players.
TI announced two new software packages for its KeyStone-based multicore system-on-chips (SoCs): a new production ready small cell Physical (PHY) software package and a transport software package for wireless and other network-oriented applications.