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Articles Tagged with ''communication''
Rohde & Schwarz achieves LTE-A Cat6 CA full stack throughput using R&S CMW500 and Qualcomm Gobi 9x35 chipset
In a joint effort, Rohde & Schwarz and Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Inc., have extensively tested the user plane throughput of the new Qualcomm® Gobi™ 9x35 chipset in compliance with 3GPP Release 10 for LTE-Advanced. In the setup on display at Mobile World Congress, the R&S CMW500 wideband radio communication tester from Rohde & Schwarz simulates the LTE-Advanced network.
Richardson RFPD Inc. announced its sponsorship of the Electronic Design Innovation Conference (EDI CON) 2014 GaN Panel.
Agilent Technologies Inc. announced it will show its newest wireless design and test solutions that address present and future test technology challenges in LTE, LTE-A, and 3GPP, Releases 11 and 12, at Mobile World Congress, Feb. 24-27, Barcelona, Spain.
Lockheed Martin recently demonstrated that the U.S. Navy’s Mobile User Objective System (MUOS) satellites may help solve communication challenges in the arctic. Now people spread over thousands of square miles could have access to more secure, reliable communications. During company-funded tests, MUOS voice and data signals reached much farther north than previously thought, just 30 miles and 0.5 degrees of latitude shy of the North Pole.
EDI CON 2014 has announced that Dr. Song Junde, professor at the Beijing University of Posts and Telecommunications, will serve as the chairman emeritus of the second annual technical conference and trade exposition focused on RF, microwave and high-speed digital design. Junde, who held the role of honorary chair for the inaugural EDI CON in March of 2013, will once again provide guidance to the event organizers and technical program planning committee in the development of a technical conference focused on advancing microwave technology and the communications industry in China.
Since embarking on its national smart metering project at the turn of the decade, more than 200 million new electricity meters have been deployed across China. However, according to ABI Research’s latest research, only around 50 million have so far been connected with bi-directional capabilities that can support true smart meter capabilities such as demand response. In short, this key smart meter project has not been that ‘smart’. But it is set to get smarter, and that means another wave of opportunity for technology providers.
Doodle Labs is proud to announce the industry first Prism family of full duplex front-end subsystems (FES). The Prism FES dramatically improves the operating range; receive sensitivity and interference rejection characteristics of the wireless adapters used in many wireless communication standards like WLAN. These field proven front-end subsystems shorten the design and regulatory certification time and enable System Integrators to quickly introduce modems operating in different frequency bands.
LTE Innovation Summit announces 2014 call for papers - convergence of wireless networks, devices, services & applications
The 5th annual LTE Innovation Summit has issued a call for papers seeking presenters from all stages of the mobile wireless ecosystem. The 2014 LTE Innovation Summit will focus on the underlying technologies that are driving the convergence of wireless networks, devices, services & applications.
DragonWave Inc., a leading global supplier of packet microwave radio systems for mobile and access networks, announced an agreement with defense and security company Saab to work collaboratively on the expansion and enhancement of national security communication networks in Sweden, Norway, Finland, Denmark and Iceland.
Linear Technology Corp. introduces the LTC2874, an IO-Link master IC, combining a power and communications interface to four remote IO-Link devices (slaves). A rugged interface and rich feature set make the LTC2874 ideal for larger systems implementing IO-Link (IEC61131-9) in harsh, industrial environments. Managing four slaves per master IC, the LTC2874 reduces board space, design complexity and costs while increasing reliability.