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Articles Tagged with ''communication''
Horizon House Publications and Microwave Journal China announced the participation of RFHIC, a global leader in the design and manufacture of RF & Microwave components, as a Gold sponsor of the 2014 Electronic Design Innovation Conference (EDI CON 2014) to be held April 8–10, 2014 at the Beijing International Convention Center in Beijing, China.
Precision Devices Inc., a member of the Avrio Technology Group LLC, has announced the extended temperature version of the LV7 series of clock oscillator products. The LV7 series is ideally suited for the communication systems where low jitter is mandated by chipset suppliers and system level performance demands.
RFMW Ltd. announces design and sales support for the TGA2611, 2 to 6 GHz LNA utilizing TriQuint’s GaN25 technology. GaN processes provide a highly robust input coupled with low noise figure and high gain, ideal characteristics for S- and C-Band radar receivers or broadband communication receivers.
Saab has signed a framework contract with the Swedish Defence Materiel Administration, for maintenance and upgrades of mobile airbase solutions for the Swedish Air Force.
It is always a concern at high millimeter wave band that there is not enough power to drive the mixer, especially full waveguide band. Model FDB-XX-E1 series externally biased, balanced mixers is especially developed for this purpose. The mixers are offered in four waveguide bands to cover frequency spectra from 50 to 140 GHz. These mixers employ high performance GaAs Schottky beamlead diodes and balanced configuration to produce superior performance with a very low LO pumping level.
Horizon House Publications and Microwave Journal China announced the lineup of Gold-level sponsors for next year’s Electronic Design Innovation Conference (EDI CON 2014). The Gold sponsors are Anritsu, CST, Spirent Communications, Mini-Circuits and Richardson RFPD.
Comtech Xicom Technology Inc., a technology leader of high power amplifier products for satellite communication (SATCOM) announces new military satellite communication (MIL-SATCOM) solid-state power amplifier block upconverters will be presented during MILCOM'13.
Leading RF GaN device manufacturers including Cree, MACOM, NXP and Freescale will discuss their GaN solutions in workshops and technical presentations to an audience of RF/microwave design engineers and system integrators.
AWR Corp., the innovation leader in high-frequency EDA software, exhibits at COMCAS 2013 and IME 2013 in Israel and China the week of October 21, 2013. At each show, the latest release of Microwave Office®, Visual System Simulator™(VSS), Analyst™, AXIEM®, and Analog Office® for the design of MMICs, RF PCBs, RFICs, microwave modules, communication systems, radar systems, antennas and more will be showcased.
Infineon Technologies has started the production of its BGTx0 chipsets for wireless backhaul communication systems. The transceiver family provides a complete radio frequency (RF) front-end for wireless communication in 57-64 GHz, 71-76 GHz, or 81-86 GHz millimeter wave bands. Paired with a baseband/modem, the system solution requires less space, offers improved reliability and lower cost for the critical wireless backhaul links needed in mobile base stations that support LTE/4G networks.