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Articles Tagged with ''mobile''

Peregrine unveils STeP8 UltraCMOS process technology

February 26, 2013

Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs),  announced from Mobile World Congress in Barcelona the latest version of UltraCMOS® process technology — Semiconductor Technology Platform 8 (STeP8). STeP8 technology shows a 36 percent improvement in RonCoff performance over STeP5 technology announced just one year ago — dramatically improving the linearity, insertion loss, and isolation capabilities of Peregrine’s RFIC products.


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Skyworks ramps antenna tuning solutions

February 27, 2013

Skyworks Solutions Inc., an innovator of high performance analog semiconductors enabling a broad range of end markets, is ramping several antenna tuning products with leading smartphone manufacturers. Skyworks’ devices are meeting the market demand for tunable antennas which dramatically improve performance by increasing data throughput, reducing dropped calls and minimizing the antenna footprint needed for today’s multiband LTE smartphones.


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Peregrine collaborates with Intel on RF front-end tuning solution

February 27, 2013

Peregrine Semiconductor Corp. announced from Mobile World Congress in Barcelona that the company is collaborating with Intel on the latest generation of its popular DuNE™ tuning technology offering for Intel’s LTE platform reference design. 


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TI and Sub10 Systems collaborate on new backhaul solution for small cell base stations

February 27, 2013

Texas Instruments Inc. (TI) and Sub10 Systems, a manufacturer of point-to-point millimetre wave radio links, announced their collaboration on a differentiated and future-proof  backhaul solution for small cell base stations.


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Skyworks expands suite of 802.11ac solutions

February 28, 2013

Skyworks Solutions Inc. expanded its wireless portfolio with the introduction of highly integrated front-end modules enabling 802.11ac connectivity in smartphones and tablets. The company’s precision analog semiconductors are already being utilized in many of the world’s first commercially-available 802.11ac notebooks, ultrabooks, LED TVs, routers, USB data cards and Blu-Ray® players.


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Ericsson to deliver mobile backhaul for T-Mobile Poland

March 4, 2013

Ericsson has been contracted to deliver mobile backhaul to Polska Telefonia Cyfrowa S.A. (PTC), the operator arm of the T-Mobile brand in Poland.


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Mediatek trumps Qualcomm in RF with world’s smallest transceiver

March 8, 2013

ABI Research finds that Mediatek has delivered the world’s smallest multimode transceiver. Coming just a week after Qualcomm announced its intentions to produce RF front ends for high tier LTE smartphones, Mediatek releases the world’s smallest RF transceiver which is also the world’s first 40 nm transceiver.


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IMT showcases Mobile Viewer-BC at Border Security Expo 2013

March 12, 2013

Integrated Microwave Technologies LLC (IMT), a business unit within the Vitec Group’s Videocom Division and a leader in advanced digital microwave systems for MAG (Military, Aerospace & Government) markets, showcases its Mobile Viewer-BC Dual-Diversity COFDM Briefcase Receiver/Monitor at Border Security Expo 2013.


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Link Microtek appoints new microwave design engineer

March 12, 2013

Link Microtek, a specialist manufacturer and supplier of RF and microwave subsystems and components, has strengthened its engineering division with the appointment of Eddie Ahn as microwave design engineer.


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Tektronix demonstrates MIPI Alliance M-PHY test solution

March 15, 2013

Tektronix Inc. announced the industry’s first demonstration of a M-PHY test solution for silicon-proven HS-Gear3 IP, a key part of the MIPI Alliance M-PHY physical layer specification for mobile devices. The Tektronix test solution allows designers to quickly and efficiently characterize designs and verify performance.


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