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Articles Tagged with ''broadband''

API Technologies high gain L-Band antenna array for Inmarsat

MarketWatch: Defense
August 21, 2012

API L-Band Antenna ArrayAPI Technologies Corp. announced a new high gain, circularly polarized antenna array developed for Inmarsat services. It is designed for use in a variety of applications including satellite networks, two-way voice and data communications and broadband portable terminals.


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EM Solutions’ Ka-Band SOTM terminal completes WGS Phase 2 certification

August 30, 2012

EM Solutions’ Ka-Band satcom on the move (SOTM) terminal has successfully completed WGS Phase 2 certification testing in Brisbane, passing all tests.


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EM Solutions to deliver Ka-Band SOTM technology to Japan

August 31, 2012

EM Solutions has won a tender with Tokyo-based partner Jepico Corp. to provide its Ka-Band Satellite on the Move (SOTM) platform to the Japanese Government’s National Institute of Information and Communications Technology (NICT). NICT is Japan’s national research institute for information and communications (http://www.nict.go.jp/en/index.html).


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Telecoms revenue in emerging APAC region to grow by $94 B in next five years

September 18, 2012

Telecoms retail revenue in the emerging Asia-Pacific (APAC) region is predicted to grow at a compound annual growth rate (CAGR) of 7 percent between 2011 and 2016, according to a new report from Analysys Mason (www.analysysmason.com). Total telecoms service revenue will grow by 29 pecent from USD229.7 billion in 2011 to USD323.7 billion by 2016.


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NoiseWave introduces a 10 MHz to 40 GHz noise generator

September 27, 2012

The NoiseWave NW-ATE series, an economical and rugged programmable noise generator, now covering from 10 MHz up to 40 GHz, is ideal for military and SATCOM applications including Ka-Band tests such as BER vs. Eb/No, interference, and jamming.

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RFMD to showcase wired broadband components at SCTE Cable-Tec Expo 2012

October 12, 2012

RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced the company will showcase its portfolio of industry-leading wired broadband components at the SCTE Cable-Tec Expo 2012, to be held October 17-19, 2012, in Orlando, Florida.


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Space Data and Lemko successfully deploy world's first commercial satellite LTE network

October 17, 2012

Space Data Corp. and Lemko Corp. announce the successful deployment of the world's first satellite-based commercial LTE network. The network was deployed in Atqasuk, Alaska and offers subscribers mobile broadband data speeds of over 70 Mbps. LTE over satellite is uniquely enabled by Lemko's patented DiMoWiNe (Distributed Mobile Wireless Network) software solution.


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Huawei maintains mobile broadband modem lead but the USB market tumbles

October 18, 2012

Greater adoption of mobile broadband modems in portable and mobile computing and the rollout of 4G networks have not been enough to overcome a downturn in USB modem shipment volumes.  New data analysis released from market intelligence firm ABI Research finds that 49 million mobile broadband modems shipped in PC and Consumer Electronics devices worldwide during the first half of 2012.


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Wi-Fi equipment market grows at 16.5%, 802.11N is the preferred wireless protocol

October 18, 2012

Cisco remains on the top spot of the enterprise Wireless Local Area Networks (WLAN) equipment market with 36 percent of the world market share followed by ZTE and Aruba based on shipments. Cisco has a dominating presence in North America and European markets, but is increasingly losing ground from close competition from ZTE in APAC, Latin America, and MEA.


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Florida RF Labs introduces broadband resistive power dividers

October 24, 2012

Florida RF Labs has added broadband resistive power dividers to the HybriX® line of signal distribution products. The new RPD series offers significant advantages over on-board multi-resistor design by providing excellent broadband frequency response, highly repeatable performance, and streamlined assembly process in a monolithic surface-mountable chip package.


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