High Speed Interconnects (HSI), an extruder and manufacturer of high-performance coaxial cable and coaxial cable assemblies, has announced a broad range of highly-custom, micro coaxial cable assemblies intended to deliver signal and power.
High Speed Interconnects (HSI), an extruder and manufacturer of high-performance coaxial cable and coaxial cable assemblies, has announced a new range of flexible cable assemblies which outperform semi-rigid cable performance.
Molex Inc. will showcase its flexible microwave cable assemblies at the International Microwave Symposium, June 1 – 6, Tampa Bay, FL, Booth 508. The assemblies replace stiff, semi-rigid assemblies with a combination of Temp-Flex® coaxial cables and high-performance radio frequency (RF) connectors.
High Speed Interconnects (www.highspeedint.com), a custom, high-performance, cable assembly manufacturer, has announced the launch of a new website which features their full product lines of ultra-high performance and robust DC-60 GHz micro coaxial and DC-70 GHz coaxial cable assemblies. Many of these assemblies feature a new ePTFE dielectric called VP90, a key enabler.
High Speed Interconnects, a custom high performance cable assembly manufacturer, is introducing its MICTOR™ Multi-Conductor Cable Assemblies. These cables are precisely impedance-matched to 50-Ohm impedance (100 Ohms in differential pairs) to achieve high performance and proven reliability in lengths and configurations that ideally match a customer’s requirements.
Fairview Microwave Inc. a preeminent supplier of on-demand microwave and RF products, introduces a new line of low loss test cables using LL335i and LL142 coax. Rated to 18 GHz, these new low loss cable assemblies are ideal for test environments where a rugged, phase stable cable assembly is required.
IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies.