Ted Rappaport, founding director of NYU WIRELESS and a leading proponent of using the millimeter wave spectrum for wireless communications, discusses the FCC's recent rulemaking actions and technology developments that are paving the way to 5G.
High Speed Interconnects (HSI), an extruder and manufacturer of high-performance coaxial cable and coaxial cable assemblies, has announced a broad range of highly-custom, micro coaxial cable assemblies intended to deliver signal and power.
High Speed Interconnects (HSI), an extruder and manufacturer of high-performance coaxial cable and coaxial cable assemblies, has announced a new range of flexible cable assemblies which outperform semi-rigid cable performance.
Molex Inc. will showcase its flexible microwave cable assemblies at the International Microwave Symposium, June 1 – 6, Tampa Bay, FL, Booth 508. The assemblies replace stiff, semi-rigid assemblies with a combination of Temp-Flex® coaxial cables and high-performance radio frequency (RF) connectors.
High Speed Interconnects (www.highspeedint.com), a custom, high-performance, cable assembly manufacturer, has announced the launch of a new website which features their full product lines of ultra-high performance and robust DC-60 GHz micro coaxial and DC-70 GHz coaxial cable assemblies. Many of these assemblies feature a new ePTFE dielectric called VP90, a key enabler.
High Speed Interconnects, a custom high performance cable assembly manufacturer, is introducing its MICTOR™ Multi-Conductor Cable Assemblies. These cables are precisely impedance-matched to 50-Ohm impedance (100 Ohms in differential pairs) to achieve high performance and proven reliability in lengths and configurations that ideally match a customer’s requirements.
Fairview Microwave Inc. a preeminent supplier of on-demand microwave and RF products, introduces a new line of low loss test cables using LL335i and LL142 coax. Rated to 18 GHz, these new low loss cable assemblies are ideal for test environments where a rugged, phase stable cable assembly is required.
IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies.