Articles Tagged with ''agilent''

Agilent simulation & modeling software selected by Nitronex for high-power GaN design

Agilent Technologies Inc. announced that Nitronex, a GaAs labs company and leading producer of GaN-on-silicon RF power devices, has selected Agilent to provide a complete GaN design flow that spans both device modeling and circuit simulation. The flow uses Agilent EEsof EDA’s IC-CAP model extraction software and Advanced Design System (ADS) circuit and system simulator—both market-leading platforms in RF and microwave design.


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Agilent announces ENA Series network analyzer that reduces cost, optimizes test of RF components

Agilent Technologies Inc. announced theE5063A ENA Series network analyzer, a low-cost ENA solution for manufacturing test. The instrument offers optimized performance and functionality for testing simple RF passive components, such as handset/BTS antennas, RF cables and filters. It can also be used in R&D for evaluation of RF passive devices and dielectric materials.


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Modelithics welcomes Syfer as MVP and announces new MW Global Model for 0603 high Q capacitors

Modelithics Inc. welcomed Syfer to the Modelithics Vendor Partner (MVP) Program. Syfer and Modelithics have collaborated to develop a Microwave Global Model™ for Syfer’s 0603 case-size High Q Ultra-Low ESR capacitor family. These simulation models are substrate scalable, part-value scalable, pad scalable, and orientation selectable (vertical or horizontal surface-mount).


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Agilent introduces series of BER test solutions for faster design verification

Test & Measurement

M8000seriesAgilent Technologies Inc. introduced the new M8000 Series BER test solution, a highly integrated and scalable bit error ratio test solution for physical-layer characterization, validation and compliance testing for receivers used in multigigabit digital designs. The new M8000 Series BER test solution provides accurate and reliable results that accelerate insight into the performance margins of high-speed digital devices.


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UBM Tech will welcome thousands to DesignCon 2014 next week

UBM Tech, the daily source of essential business and technical information for decision makers in the electronics industry, will welcome thousands of influential members of the chip, package and board design communities to DesignCon 2014, January 28 – 31, at the Santa Clara Convention Center in Santa Clara, California. Recognized as the premier annual trade event and technical conference dedicated to the pervasive nature of signal integrity at all levels of electronic design, DesignCon will host Keynote Speakers from Intel, Micron Technologies and XPRIZE.  


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