- Buyers Guide
What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.
Agilent Technologies Inc. launched the Agilent EEsof EDA Student License Program, designed to provide access to Agilent EEsof EDA software on students’ personal computers.
AWR Corp., the innovation leader in high-frequency EDA software, announced the sponsorship of two major student design competitions in China as part of the company’s continuing focus on working with universities worldwide to empower students with RF/microwave software tool experience and jumpstart their engineering careers.
Answering the growing need for smartphone and tablet applications that update seamlessly, Texas Instruments Inc. (TI) announces a truly wireless solution with a unique over-the-air-download (OTA or OAD) feature in its BLE-Stack™ 1.3 software for use with the CC2540 and CC2541 Bluetooth low energy system-on-chips (SOCs). Single-mode Bluetooth® low energy or Bluetooth Smart is increasing in popularity because it allows consumers to connect to their smartphones and tablets to automotive, home office, medical and health, sports and fitness as well as mobile and PC accessories.
AWR Corp. announces the addition of two new stories to its roster of university student and professor design successes using AWR software. These new stories include contributions from Okinawa National College of Technology in Japan and Macquarie University in Australia.
Tektronix Inc. announced the industry’s first demonstration of a M-PHY test solution for silicon-proven HS-Gear3 IP, a key part of the MIPI Alliance M-PHY physical layer specification for mobile devices. The Tektronix test solution allows designers to quickly and efficiently characterize designs and verify performance.
AWR Corp., the innovation leader in high-frequency EDA software, announces that it will continue to offer its popular Graduate Gift Initiative to graduating engineering students worldwide for a record fourth consecutive year.
Agilent Technologies Inc. announced that Plextek RF Integration, a UK-based company that designs and develops RFICs, MMICs and microwave/millimeter-wave modules, has selected Agilent software to simulate its new high-frequency circuit and MMIC designs.
Maxim Integrated Products Inc. announced the MAX2173 RF to Bits tuner for digital audio broadcast (DAB) applications in automobiles and other mobile DAB/FM products. The industry’s first RF to Bits DAB/FM tuner integrates a radio tuner, analog-to-digital converter (ADC), and digital filtering, and uses a digital I2S output to interface directly to digital signal processors (DSPs).
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