Rakon, a leading global provider of frequency control solutions, and Symmetricom® Inc., a worldwide leader in precision time and frequency, announced that Rakon has joined Symmetricom’s SyncWorld® Ecosystem Program.
AWR Corp., the innovation leader in high-frequency EDA, and Magus (Pty) Ltd, developers of the leading antenna synthesis product Antenna Magus, announce Antenna Magus Version 4.1, which adds four new antenna types:
Today it is hard to imagine data exchange and instrument control without USB. No other interface has achieved such popularity for user equipment, electronic consumer goods and industrial products. As a result, the need for reliable, fast test solutions in development and integration has also increased. New software from Rohde & Schwarz makes the company's high-performance oscilloscope ideal for automated USB 2.0 compliance tests.
Elma Electronic Inc., in cooperation with Pentek Inc. and Concurrent Technologies, has developed a small form factor (SFF), OpenVPX-based signal acquisition system for processing and recording applications.
AWR Corp. and Optenni Ltd. announced AWR Connected for Optenni Lab, an integrated workflow that accelerates wireless antenna design by enabling optimized matching circuits to be transferred from Optenni Lab matching circuit software to AWR’s Microwave Office high-frequency design software with a single mouse click. The interface constructs the matching circuit in Microwave Office, sets up and runs the simulation, and then allows for further refinement and analysis within Microwave Office and AXIEM®, AWR’s 3D planar electromagnetic simulator.
Computer Simulation Technology (CST) will be previewing CST STUDIO SUITE 2013 and its new design environment at EuMW 2012, booth #217. The increasingly complex tasks design engineers face today require a large number of sometimes specialised features. Simulation software vendors such as CST have enhanced their tools to accommodate these requirements.
Texas Instruments Inc. (TI), leading the industry with the most complete wireless connectivity portfolio for embedded applications,today announced that its Bluetooth® v4.0 technology-based CC2560 and CC2564 wireless devices are now available in easy-to-integrate QFN packages offered by TI and its distribution partners. TI also announced the availability of additional production-ready modules based on the two devices, as well as software and tools.