Articles Tagged with ''high-power''

RFS introduces high-power 3 dB directional coupler for use in the UHF TV Band

Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announces its new high-power 3 dB directional coupler for use in the UHF TV band for transmitter and channel combining. The RFS DC618E-HP, rated for 80 to 120 kW depending on application at UHF frequencies 470 to 700 MHz, is the latest addition to RFS’ family of directional couplers and will change the landscape for balanced combining applications.


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Cirexx presents ECLIPS at IMS 2014

Cirexx International is presenting the new ECLIPS technology this week at the International Microwave Symposium (IMS) at the Tampa Convention Center.  ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF and microwave Printed Circuit Boards (PCBs) employing an embedded low-CTE, thermally engineered metalized layer which has superior thermal conductivity characteristics.


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Vishay Intertechnology Power Metal Strip® current sense resistors feature operation to +275 °C

Vishay Intertechnology Inc. introduces the industry's first surface-mount, four-terminal Power Metal Strip® current sensing resistors in the compact 2726 and 4026 case sizes to provide an operating temperature range to +275 °C. The Vishay Dale WSLT2726 and WSLT4026 combine their high-temperature performance with 3 W power ratings and extremely low resistance values down to 0.002 Ω.


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Low Capacitance PIN Diodes

SemiGen_PINdiodes_PR2SemiGen Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, offers PIN diodes that feature low capacitance and resistance, high reliability, and easy bonding with F.A.C. mesas. These devices are typically manufactured with either a robust thermal-oxide passivation or ceramic glass for durable high-power applications. These diodes are made with a grown junction P++ layer that yields abrupt junction structures.


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Comtech Telecommunications Corp. awarded $1.4M for high-power amplifiers

Comtech Telecommunications Corp. announced that its Santa Clara, California-based subsidiary, Comtech Xicom Technology, Inc., has been awarded a contract totaling $1.4 million from a major system integrator to supply rack-mount, high-power amplifiers ("HPAs"). The HPAs will be used in an expansion of a system that relays military satellite communications around the world and that is already using similar Comtech Xicom HPAs.


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