Molex Inc. announced its NeoScaleTM High-Speed Mezzanine System at DesignCon 2014. Delivering remarkably clean signal integrity at data rates of 28+ Gbps, the modular mezzanine interconnect is designed for high-density printed circuit board (PCB) mezzanine applications with limited PCB real estate. Industry applications include enterprise networking towers, telecommunication hubs and servers, industrial controllers, and medical and military high data-rate scanning equipment.
The Molex SpeedStack™ mezzanine connector system provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications. Compact SpeedStack connectors feature a stack height of 4.00mm and support data rates up to 40 Gbps per differential pair. SpeedStack connectors will be displayed at Molex booth 117, DesignCon 2014.
Analog Devices Inc. unveiled the newest addition to its line of FPGA development platform-compatible FPGA mezzanine cards (FMC) incorporating JEDEC JESD204B SerDes (serializer/de-serializer) technology today. Digital and analog designers can use the AD9250-FMC-250EBZ kit to simplify and rapidly prototype high-speed JESD204B A/D converter-to-FPGA platforms.