Articles Tagged with ''devices''
February 13, 2012
Achieving another wireless connectivity milestone, Texas Instruments Inc. (TI) introduced the WiLink™ 8.0 product family, a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi®, GNSS, NFC, Bluetooth® and FM transmit/receive applications.Read More
February 8, 2012
Agilent Technologies Inc. announced that Bluetest AB now supports Agilent’s PXT wireless communications test set.Read More
February 8, 2012
RFMD’s new RF3235 and RF3237, paired with one or more discrete 3G power amplifiers such as RF722x or RF724x, enable best-in-class performance at the lowest total solution cost for 3G entry platforms.Read More
February 3, 2012
National Instruments (NI) announced early access support for testing next-generation 802.11ac WLAN chipsets and devices.Read More
February 2, 2012
Anritsu Co. announced its MP1800A BER Tester was part of a live demonstration of 25-28 Gb/s CDR retimers designed to support emerging 100 Gb/s networking applications that was conducted by Gennum Corp., a supplier of high-speed optical, analog and mixed signal semiconductor solutions.
January 27, 2012
TriQuint Semiconductor Inc., a RF solutions supplier and technology innovator, announced it has received several industry awards and recognition from key customers in China during 2011.Read More
January 18, 2012
RF Micro Devices Inc. (RFMD), a designer and manufacturer of high-performance radio frequency components and compound semiconductor technologies, announced the release of the RFFM6201, a 2.4 GHz band single-chip Zigbee® front-end module (FEM) featuring an integrated power amplifier, low noise amplifier and diversity switch.Read More
MMICS & More
January 11, 2012
TriQuint Semiconductor Inc. announced that it has begun work on Phase II of the Defense Advanced Research Projects Agency (DARPA) multi-year Nitride Electronic NeXt-Generation Technology (NEXT) program as a prime contractor.